Electrostatic Chuck Release Control Using Detachment Load
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in accurately determining the adsorption state of substrates on electrostatic chucks, leading to issues like warping, cracking, and increased costs due to sensor complexity, especially during high-temperature processing.
Innovation Solution
A substrate processing apparatus with a control device that determines the load on a drive source or detachment device to apply a release voltage to the electrostatic chuck, adjusting the release voltage based on load measurements to ensure safe and timely substrate release, reducing residual adsorption forces without damaging the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If sensors are used to determine substrate adsorption state, then measurement precision is improved, but device complexity and cost increase
Solution Approach 1:
The electrostatic chuck itself serves as the sensing element by detecting changes in its own electrical characteristics (capacitance, impedance, or voltage) that occur when the substrate adsorption state changes. This self-service approach eliminates the need for separate sensors while maintaining measurement capability.
Solution Approach 2:
The patent replaces mechanical or optical sensing systems with electrical field-based detection. By monitoring electrical parameter changes in the electrostatic chuck, the system substitutes complex mechanical sensors with simpler electrical measurement circuits.
2Ease of operation
If release voltage is applied to electrostatic chuck, then substrate release is achieved, but substrate warping or cracking may occur due to residual adsorption forces
Solution Approach 1:
The system applies a preliminary detection step by measuring electrical parameter changes to determine the substrate adsorption state before applying release voltage. This preliminary action ensures release voltage is only applied when appropriate, preventing substrate damage from premature or unnecessary voltage application.
Solution Approach 2:
The system continuously monitors electrical parameters of the electrostatic chuck and uses this feedback to determine when the substrate has been properly released. This feedback mechanism prevents residual adsorption forces from causing substrate warping or cracking by ensuring complete release before subsequent operations.
3Productivity
If high-temperature processing is performed, then productivity is improved, but substrate warping increases due to thermal effects
Solution Approach 1:
The system performs preliminary detection of substrate adsorption state through electrical parameter monitoring before high-temperature processing begins. This ensures proper substrate positioning and adsorption, preventing warping even when thermal expansion occurs during high-temperature processing.
Solution Approach 2:
The continuous monitoring of electrical parameters provides feedback on substrate adsorption state during high-temperature processing. This feedback allows real-time detection of any warping or positioning changes, enabling corrective actions to maintain substrate integrity during productivity-enhancing high-temperature operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Accurate determination of substrate adsorption state reduces warping and damage, enhances productivity, and minimizes the need for additional sensors, thereby lowering costs and improving operational efficiency.
Implementation Method 1
an electrostatic chuck that is configured to support a substrate
Implementation Method 2
applies a release voltage to the electrostatic chuck, based on the load
Data Source
AI summary
A substrate processing apparatus includes an electrostatic chuck that supports a substrate, a detachment device that releases the substrate that is supported by the electrostatic chuck, from the electrostatic chuck, and a control device that determines a load on the detachment device and applies a release voltage to the electrostatic chuck, based on the load.