Hybrid Composite Electrostatic Chuck With Replaceable Guide Plate
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Solution Overview
Problem
Existing electrostatic chucks (ESCs) in semiconductor processing chambers face challenges in repair and refurbishment due to wear and tear, making it difficult and expensive to replace or refurbish the guide plate, which is secured using bonding methods.
Innovation Solution
The ESC design incorporates a mechanical interlock between the guide plate and the main body, eliminating the need for a bond layer, allowing for easy replacement and repair, with features like angled sidewalls and rotational locating mechanisms to maintain stability and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding methods are used to secure the guide plate to the main body, then the ESC maintains structural integrity and stability, but it becomes difficult and expensive to replace or refurbish the guide plate
Solution Approach 1:
The ESC is divided into separable components: the guide plate and the main body. The guide plate can be removed and replaced independently from the main body, allowing for easy refurbishment without replacing the entire ESC assembly. This segmentation resolves the contradiction by enabling both structural integrity during operation and ease of repair during maintenance.
Solution Approach 2:
The connection between the guide plate and main body transitions from a static bonded state to a dynamic state where the guide plate can be easily attached and detached. This dynamic connection allows the system to adapt between operational stability and maintenance accessibility, resolving the contradiction between reliability and ease of repair.
2Strength
If a bond layer is used to attach the guide plate to the main body, then the connection is strong and stable, but the repair process becomes time-consuming and costly
Solution Approach 1:
The connection system is segmented into mechanical interlocking features rather than requiring a bond layer. This allows the guide plate to be quickly attached and detached without time-consuming bonding processes, while still maintaining strong connection strength during operation through the mechanical interlock.
Solution Approach 2:
The chemical bonding system is replaced with a mechanical interlocking system. The mechanical features provide sufficient connection strength during operation while enabling rapid assembly and disassembly, eliminating the time-consuming nature of bonding processes and resolving the contradiction between connection strength and repair time.
3Stability of the object's composition
If the guide plate is securely bonded to the main body, then lateral and rotational movement is prevented, but replacement and refurbishment become difficult
Solution Approach 1:
The stable connection is achieved through segmented mechanical interlocking features rather than a permanent bond layer. These features maintain position stability during operation while allowing the guide plate to be removed and reattached, resolving the contradiction between stability and ease of repair.
Solution Approach 2:
The connection system dynamically adapts between providing stable mechanical interlocking during operation and allowing easy removal during maintenance. The mechanical features ensure position stability when assembled while enabling quick disassembly, resolving the contradiction between stability and repairability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy and cost-effective replacement of the guide plate, extending the ESC's lifespan and reducing maintenance costs by preventing lateral and rotational movement, while maintaining uniform heat distribution and electrostatic holding capabilities.
Implementation Method 1
a heater embedded within the main body
Implementation Method 2
electrostatic forces generated by a voltage difference between the wafer and the RF electrode
Implementation Method 3
The ESC 12 holds the wafer 20 by using the Coulomb force
Implementation Method 4
the Johnsen-Rahbek effect generated when a voltage-applied dielectric material is charged, and its electrodes are polarized
Data Source
AI summary
An electrostatic chuck (ESC) for use in semiconductor processing includes a main body comprising an upper mounting surface, the upper mounting surface defining a surface profile and a guide plate coupled to the upper mounting surface of the main body. The guide plate includes a lower mounting surface. The lower mounting surface defines a surface profile that follows the surface profile of the upper mounting surface of the main body. The ESC further includes a heater embedded within the main body and a radio frequency (RF) electrode embedded within the guide plate. The main body is coupled to the guide plate via a connection consisting of a mechanical interlock.