Electrostatic Chuck Plug Structure for Replaceable Gas Flow
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Solution Overview
Problem
Existing electrostatic chucks in semiconductor manufacturing apparatuses face challenges in easily replacing the porous plugs that allow gas flow, leading to potential electric discharge and wafer damage during plasma processing.
Innovation Solution
A member for a semiconductor manufacturing apparatus featuring a ceramic plate with a plug disposition hole having a truncated conical space, a truncated conical plug allowing gas flow, an adhesive layer between the plug and the hole, and a conductive baseplate with a gas supply path, enabling easy replacement of the plug and minimizing air bubble formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the porous plug is fixed by sintering or adhesive in a bottomed recessed portion, then the plug is securely fixed, but the plug cannot be easily replaced when needed
Solution Approach 1:
The plug disposition hole is divided into two distinct sections: an upper truncated conical space for accommodating the plug, and a lower through-hole section for gas supply. This segmentation allows the plug to be accessible from the upper opening for easy replacement while maintaining secure fixation through the adhesive layer in the conical space.
Solution Approach 2:
An adhesive layer is introduced as an intermediary substance between the plug and the inner peripheral surface of the plug disposition hole. This adhesive layer provides reliable fixation while allowing the plug to be removed by cutting or softening the adhesive, thus enabling replacement without compromising fixing reliability.
2Ease of manufacture
If the adhesive flows down during adhesion, then the adhesive fills the space, but air bubbles are produced inside the adhesive leading to electric discharge
Solution Approach 1:
The plug disposition hole features an asymmetric truncated conical shape with a larger upper opening area than lower opening area. This asymmetric geometry causes the adhesive to be held back by the tapering walls, preventing downward flow and trapping air bubbles, while still allowing complete coverage of the plug's outer peripheral surface for secure adhesion.
Solution Approach 2:
The truncated conical shape provides a curved, tapering surface that naturally guides the adhesive upward and outward during application, preventing it from flowing downward into the through-hole section where air bubbles would form. The curved geometry ensures uniform adhesive distribution without trapping air.
3Reliability
If a bottomed recessed portion is used to accommodate the plug, then the plug is fixed in place, but the plug cannot be accessed for replacement from above
Solution Approach 1:
The plug disposition hole is segmented into an upper truncated conical space that is open at the top for plug access, and a lower through-hole section for gas supply. This segmentation maintains secure fixation in the conical space while providing open access from the upper opening for plug replacement operations.
Solution Approach 2:
The plug disposition hole structure serves multiple functions: the upper truncated conical space provides both plug accommodation and access, while the lower through-hole section provides gas supply. This multi-functional design eliminates the need for separate access paths while maintaining fixation reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for easy replacement of the gas flow plugs and significantly reduces the likelihood of electric discharge near the plugs during plasma processing, enhancing the reliability and efficiency of semiconductor manufacturing.
Implementation Method 1
an adhesive layer that is provided between an inner peripheral surface of the plug disposition hole and an outer peripheral surface of the truncated conical plug
Implementation Method 2
a truncated conical plug that is disposed in the plug disposition hole, that allows gas to flow in the up-down direction
Implementation Method 3
an electrostatic chuck having a wafer placement surface at its upper surface
Data Source
AI summary
A member for a semiconductor manufacturing apparatus includes: a ceramic plate that has a wafer placement surface at an upper surface thereof; a plug disposition hole that extends through the ceramic plate in an up-down direction and that has a truncated conical space whose upper opening is larger than a lower opening thereof; a truncated conical plug that is disposed in the plug disposition hole, that allows gas to flow in the up-down direction, and whose upper surface is larger than a lower surface thereof; an adhesive layer that is provided between the plug disposition hole and the truncated conical plug; an electrically conductive baseplate that is joined to a lower surface of the ceramic plate through a joint layer; and a gas supply path that is provided in the baseplate and the joint layer and that supplies gas to the truncated conical plug.