Electrostatic Chuck Gas Conduit Sealing to Reduce Residue Clogging
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Solution Overview
Problem
Existing electrostatic chucks in semiconductor processing systems face issues with clogging due to residue formation, which affects inert gas flow and thermal uniformity, leading to reduced die yield and increased costs.
Innovation Solution
The electrostatic chuck design includes a top plate with a first plug and a second plug arranged between the top plate and a spring member, eliminating the gap between the top plate and the second plug, thereby reducing exposure to reactive species and minimizing residue generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a gap is maintained between the top plate and the second plug for assembly tolerance, then ease of manufacture is improved, but residue formation increases due to exposure to reactive species
Solution Approach 1:
A sleeve made of non-porous ceramic material is introduced as an intermediary component between the second plug and the top plate. This sleeve acts as a barrier that prevents reactive species from reaching the bonding material and generating residue, while still allowing the second plug to be positioned with tolerance for assembly. The sleeve effectively mediates between the need for assembly tolerance and the need to minimize residue formation.
2Quantity of substance
If the second plug is made porous to allow gas flow, then inert gas flow is improved, but clogging increases due to residue deposition in pores
Solution Approach 1:
The second plug is designed with non-uniform porosity: the portion in contact with the top plate is made non-porous to prevent residue deposition and clogging, while other portions maintain porosity to allow inert gas flow. This local differentiation of material properties allows the system to simultaneously achieve good gas flow and resistance to clogging.
3Strength
If bonding material is used to attach the top plate to the baseplate, then joining strength is improved, but residue generation increases due to exposure to reactive species
Solution Approach 1:
The sleeve serves as a protective intermediary that shields the bonding material from direct exposure to reactive species in the plasma environment. By placing the non-porous ceramic sleeve between the bonding material and the plasma, the system maintains strong joining while preventing the chemical reactions that would otherwise generate residue on the bonding material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces clogging and residue formation, ensuring consistent inert gas flow and improved thermal uniformity, thereby enhancing die yield and reducing operational costs.
Implementation Method 1
A first spring member is arranged in the cavity. A second plug is arranged between the top plate and the first spring member
Implementation Method 2
The first plug is made of porous ceramic and is formed insitu in the top plate. The second plug is made of porous ceramic
Implementation Method 3
A bonding material attaches the top plate to the first surface of the baseplate
Implementation Method 4
The ESC supplies an inert gas (such as helium (He)) to a back side surface of the substrate. The inert gas acts as a thermal transfer medium between the top plate and the backside surface of the substrate
Data Source
AI summary
An electrostatic chuck for a substrate includes a baseplate including a first surface and a cavity arranged on the first surface. A top plate includes a first plug. A first spring member is arranged in the cavity. A second plug is arranged between the top plate and the first spring member. A bonding material attaches the top plate to the first surface of the baseplate.