Electrostatic Chuck Temperature Uniformity via Heat-Conductive Resin
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Solution Overview
Problem
Variations in heat density at the substrate setting surface of electrostatic chucks in semiconductor processing devices lead to temperature inconsistencies, affecting the etching rate and yield of semiconductor elements.
Innovation Solution
An electrostatic chuck with a base plate, adhesive layer, and electrostatic chuck plate incorporating electrostatic electrodes and resistance heat generation bodies, along with adjustment portions filled with a heat-conductive resin to manage temperature distribution, ensuring uniform heat density and substrate temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional electrostatic chuck plate with cooling mechanism is used, then substrate temperature control is achieved, but heat density varies at the upper surface causing temperature inconsistencies
Solution Approach 1:
The patent applies local quality by creating adjustment portions with different heat conductivities at specific locations on the base plate. These adjustment portions have heat conductivities that differ from both the base plate and electrostatic chuck plate, allowing localized modification of heat flow paths to achieve uniform heat density distribution across the substrate setting surface.
Solution Approach 2:
The patent changes the heat conductivity parameter by introducing adjustment portions with intermediate heat conductivity values between the base plate and electrostatic chuck plate. This parameter modification allows fine-tuning of heat transfer characteristics to compensate for non-uniform heat distribution without changing the overall structure.
2Temperature
If adjustment portions with different heat conductivities are added to achieve uniform heat distribution, then temperature uniformity improves, but device complexity increases
Solution Approach 1:
The patent segments the base plate by adding discrete adjustment portions at specific locations rather than modifying the entire structure. These adjustment portions are strategically placed to address local heat distribution issues, dividing the heat control function into manageable segments that can be independently optimized.
Solution Approach 2:
The adjustment portions act as intermediary elements between the base plate and electrostatic chuck plate. These intermediate layers with specific heat conductivity values mediate the heat transfer process, smoothing out heat density variations without requiring complete restructuring of the electrostatic chuck system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform heat distribution and temperature control on the substrate, enhancing the etching rate and yield of semiconductor elements by adjusting heat density through strategically positioned adjustment portions and heat-conductive resin in the electrostatic chuck.
Implementation Method 1
an electrostatic electrode capable of attracting the processed substrate
Implementation Method 2
a resistance heat generation body capable of heating the processed substrate
Implementation Method 3
The base plate includes a cooling mechanism
Implementation Method 4
a resin having a heat conductivity according to the temperature distribution and filled in the adjustment portion
Data Source
AI summary
An electrostatic chuck plate is connected to a base plate, which includes a cooling mechanism, by an adhesive layer. The electrostatic chuck plate includes a substrate setting surface on which a processed substrate is set, an electrostatic electrode capable of attracting the processed substrate, and a resistance heat generation body capable of heating the processed substrate. The electrostatic electrode and the resistance heat generation body are incorporated in the electrostatic chuck plate. An adjustment portion is arranged at a position according to a temperature distribution of the substrate setting surface in at least one of the upper surface of the base plate and a lower surface of the electrostatic chuck plate that faces the upper surface through the adhesive layer. The adjustment portion is filled with a resin having a heat conductivity according to the temperature distribution.