Electrostatic Chuck Heater Resistance Sensing for Precise Temperature Control
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Solution Overview
Problem
The increasing demand for precise temperature control in semiconductor manufacturing, particularly in miniaturized processes, is hindered by the complexity and reduced design freedom of placing tables with numerous independently controllable heaters and temperature sensors, which complicates the miniaturization and simplification of the substrate processing system.
Innovation Solution
A substrate processing system with a control device that estimates temperatures in divided regions based on resistance values from embedded heaters, allowing for precise temperature control without the need for extensive temperature sensors, using AC voltage and current measurements and a conversion table to adjust power supply to heaters, and optional temperature sensor corrections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If independently controllable heaters and temperature sensors are provided in each divided region on the placing table, then temperature control accuracy is improved, but device complexity increases
Solution Approach 1:
The patent extracts the temperature measurement function from dedicated temperature sensors and transfers it to the heaters themselves by utilizing the resistance-temperature relationship. This eliminates the need for separate temperature sensors in each region, reducing device complexity while maintaining temperature monitoring capability.
Solution Approach 2:
The heaters are designed to serve dual functions: heating the substrate and measuring temperature through their resistance characteristics. This multi-functionality reduces the total component count and simplifies the placing table structure while ensuring accurate temperature control in each divided region.
2Manufacturing precision
If numerous independently controllable heaters and temperature sensors are installed, then temperature control precision is improved, but ease of manufacture deteriorates
Solution Approach 1:
By removing the requirement for separate temperature sensors in each region, the patent significantly reduces the number of components that need to be installed and calibrated during manufacturing, thereby improving ease of manufacture while maintaining temperature uniformity through the heaters' dual functionality.
3Productivity
If the placing table is miniaturized, then productivity is improved, but device complexity increases due to space constraints
Solution Approach 1:
The patent enables placing table miniaturization by making the heaters multi-functional. Each heater serves both heating and temperature sensing purposes, eliminating the need for separate sensor components and their associated wiring and control circuits. This reduction in component count directly facilitates miniaturization of the placing table while maintaining independent temperature control capability in each region, thereby improving productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables miniaturization and simplification of the placing table structure while maintaining high accuracy in temperature control, reducing the complexity and improving design freedom by eliminating the need for extensive temperature sensor arrays.
Implementation Method 1
a table for each of the division regions, the table indicating a relationship between a resistance value of each of the heaters embedded in the placing table and a temperature of each of the division regions
Implementation Method 2
controls an electric power to be supplied to each of the heaters so that the estimated temperature becomes a target temperature
Data Source
AI summary
A substrate processing system includes a substrate processing apparatus and a control device. The substrate processing apparatus includes a chamber, and a placing table provided inside the chamber. The placing table places a substrate thereon, and includes a base and an electrostatic chuck provided on an upper surface of the base. The electrostatic chuck has a plurality of division regions each provided with a heater therein. The substrate processing system also includes a control device that includes a measuring unit that measures a resistance value of the heater for each of the division regions, an estimating unit that estimates a temperature of each of the division regions based on the resistance value of the heater measured by the measuring unit, and a power controller that controls a power supplied to the heater for each of the division regions based on the temperature estimated by the estimating unit.