Electrostatic Chuck Assembly for High-RF Substrate Temperature Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing radio frequency power applied to substrate supports in plasma processing apparatuses leads to insufficient temperature control of substrates, resulting in decreased processing efficiency and potential damage due to heat input from plasma.
Innovation Solution
A substrate processing apparatus is designed with an electrostatic chuck made of ceramic, a base with a channel for a heat exchange medium, a low linear expansion coefficient member, a heat transfer sheet, a fixing part, and a conductive member to enhance temperature control efficiency. The heat transfer sheet and conductive member improve heat conduction and sealing, while the low linear expansion coefficient member reduces thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If radio frequency power is increased to improve processing efficiency, then productivity increases, but temperature control deteriorates and substrate may be damaged
Solution Approach 1:
The patent introduces a heat transfer sheet as an intermediary component between the electrostatic chuck and the base. This heat transfer sheet has high thermal conductivity and serves as a mediator to efficiently conduct heat away from the substrate, enabling better temperature control even when high RF power is applied for improved processing efficiency
Solution Approach 2:
The substrate support structure uses composite materials including the heat transfer sheet with high thermal conductivity combined with the electrostatic chuck and base materials. This composite structure optimizes both heat dissipation and electrical insulation properties, allowing high RF power application without compromising temperature control
2Ease of manufacture
If adhesive layer is used to bond electrostatic chuck and base, then ease of manufacture improves, but heat transfer efficiency deteriorates
Solution Approach 1:
The heat transfer sheet acts as an intermediary bonding interface between the electrostatic chuck and the base, replacing the adhesive layer. This intermediary component provides both mechanical bonding and excellent thermal conduction, eliminating the thermal resistance problem caused by adhesive layers while maintaining ease of assembly
Solution Approach 2:
The patent extracts and removes the adhesive layer from the bonding structure, replacing it with the heat transfer sheet that directly contacts both the electrostatic chuck and the base. This extraction eliminates the thermal barrier effect of the adhesive while maintaining structural integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves the temperature control accuracy and efficiency of the substrate support, reducing heat input from plasma and preventing damage, while also lowering processing costs and maintaining high thermal conductivity.
Implementation Method 1
a base that has a channel through which a heat exchange medium flows
Implementation Method 2
allowing a temperature-controlled heat exchange medium to flow from a chiller unit to a channel of a substrate support
Implementation Method 3
an electrostatic chuck that is made of ceramic and holds a substrate to be processed by electrostatic attraction
Implementation Method 4
a heat transfer sheet disposed between the low linear expansion coefficient member and the base
Data Source
AI summary
There is a substrate processing apparatus comprising: a processing chamber; a substrate support disposed in the chamber; and a power supply configured to supply a radio frequency (RF) power to at least the substrate support, wherein the substrate support includes: an electrostatic chuck that is made of ceramic and holds a substrate by electrostatic attraction; a base that has a channel through which a heat exchange medium flows and supports the electrostatic chuck; a low linear expansion coefficient member disposed between the electrostatic chuck and the base; a heat transfer sheet disposed between the low linear expansion coefficient member and the base; a fixing part configured to fix the heat transfer sheet to the low linear expansion coefficient member; and a conductive member that is disposed between the low linear expansion coefficient member and the base and electrically connects the low linear expansion coefficient member and the base.