Electrostatic Chuck Segmented Electrodes for Damage Tolerance
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Solution Overview
Problem
Conventional electrostatic chucks used in semiconductor and display manufacturing are prone to performance degradation due to electrode damage, which affects the stability and efficiency of substrate holding, especially on large substrates.
Innovation Solution
The electrostatic chuck design includes a first and second common wire with alternating electrode patterns connected by additional wires, allowing for disconnection of damaged electrode regions to prevent voltage application and maintain electrostatic force, thereby minimizing performance degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electrostatic chucks are used with fine electrodes, then substrate holding function is achieved, but electrode damage occurs easily leading to performance degradation
Solution Approach 1:
The electrode is divided into multiple segments separated by insulating grooves. When damage occurs to one segment, only that specific segment is affected while other segments continue to function normally, preventing complete electrode failure and reducing performance degradation.
Solution Approach 2:
Insulating grooves are strategically positioned at specific locations where electrode damage is most likely to occur or where damage would have the greatest impact. This localized insulation approach protects critical areas while maintaining overall electrode functionality.
2Force
If bipolar type electrostatic chuck is used for large substrates, then strong electrostatic force is achieved at low voltage, but fine electrodes are easily damaged
Solution Approach 1:
The bipolar electrode structure is segmented into multiple sections with insulating grooves between them. This segmentation reduces the stress concentration on any single electrode region, making the fine electrodes more resistant to damage while maintaining the strong electrostatic force needed for large substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the electrostatic chuck's ability to maintain electrostatic force even with damaged electrodes, reducing performance degradation and enabling stable substrate holding during thin film deposition processes.
Implementation Method 1
An electrostatic chuck is a tool for holding a substrate onto a lower electrode by using an electrostatic force. The electrostatic chuck may be classified as either a unipolar type electrostatic chuck that attracts the substrate onto the unipolar type electrostatic chuck by generating a potential difference between an electrode and the substrate
Data Source
AI summary
An electrostatic chuck, a thin film deposition apparatus including the electrostatic chuck, and a method of manufacturing an organic light emitting display apparatus using the thin film deposition apparatus. The electrostatic chuck includes: a first plate; a first common wire disposed on the first plate and electrically connected to a plus terminal of an electric power source; first electrode patterns electrically connected to the first common wire, separated by a distance from each other, and extending from the first common wire; a second common wire disposed on the first plate and electrically connected to a minus terminal of the electric power source; second electrode patterns electrically connected to the second common wire, separated by a distance from each other, and extending from the second common wire; a first additional wire electrically connected to the first common wire; and a second additional wire electrically connected to the second common wire.