Electrostatic Chuck Segmented Electrodes for Film Uniformity
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Solution Overview
Problem
Existing semiconductor processing apparatuses face challenges in effectively supporting and heating wafers during high-temperature chemical vapor deposition (CVD) processes, particularly in maintaining uniform chucking forces and film properties.
Innovation Solution
The electrostatic chuck apparatus incorporates a chuck plate with an inner disc-shaped electrode and multiple outer electrodes arranged radially, along with a heater electrode and conductive wires connected to a DC power supply and impedance control module, allowing for independent control of power and impedance to achieve precise chucking forces and temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional single electrode configuration is used, then the device complexity is low, but the manufacturing precision of film properties and chucking force uniformity deteriorates
Solution Approach 1:
The single electrode is divided into multiple segments: an inner electrode and multiple outer electrodes arranged radially. Each electrode can be independently controlled, allowing precise control of chucking forces and temperature distribution to achieve uniform film properties.
Solution Approach 2:
Different regions of the chuck plate are assigned different electrode configurations. The inner electrode and outer electrodes can be controlled independently to provide localized control of chucking forces and temperature, ensuring uniform film properties across the wafer surface.
2Manufacturing precision
If multiple independently controllable electrodes are used, then the manufacturing precision of chucking forces is improved, but the device complexity increases
Solution Approach 1:
The electrode system is segmented into multiple independent electrodes (inner and outer electrodes) that can be controlled separately. This segmentation enables precise control of chucking forces in different regions to achieve uniform holding force across the wafer.
Solution Approach 2:
The electrodes are designed with dynamic control capabilities through independent power supply connections, allowing real-time adjustment of voltage and current to each electrode. This enables adaptive control of chucking forces to maintain uniformity during the CVD process.
3Adaptability or versatility
If multiple electrodes with different geometries are used, then the adaptability of temperature control is improved, but the ease of manufacture deteriorates
Solution Approach 1:
The electrode system is divided into multiple segments with different geometric configurations (inner circular electrode and outer annular electrodes). Each segment can be independently manufactured and then assembled, facilitating the creation of complex temperature control patterns while maintaining manufacturability.
Solution Approach 2:
The electrodes are arranged in a nested configuration where the inner electrode and outer electrodes are positioned concentrically within the chuck plate. This nested arrangement allows for compact integration of multiple functional elements while simplifying the overall manufacturing process through standardized mounting structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient wafer support and heating during high-temperature CVD, improving film uniformity and quality by allowing for localized control of chucking forces and temperature, thus addressing the limitations of existing technologies.
Implementation Method 1
an inner electrode disposed inside the chuck plate and having a disc shape in a central portion of the chuck plate; and a plurality of outer electrodes disposed inside the chuck plate and adjacent to the inner electrode in a radial direction of the chuck plate
Implementation Method 2
a heater electrode overlapping the inner electrode, the first outer electrode, and the second outer electrode
Data Source
AI summary
An electrostatic chuck apparatus includes: a chuck plate configured to support a wafer; a shaft extending from a bottom surface of the chuck plate in a vertical direction and configured to support the chuck plate; an inner electrode disposed inside the chuck plate and having a disc shape in a central portion of the chuck plate; and a plurality of outer electrodes disposed inside the chuck plate and adjacent to the inner electrode in a radial direction of the chuck plate, wherein the plurality of outer electrodes include a first outer electrode including: a first side portion having a cylindrical shape and extending in the vertical direction; a first top portion having a planar annular shape and connected to an upper end of the first side portion; and a first bottom portion having a planar annular shape and connected to a lower end of the first side portion.