Electrostatic Chuck Segmented Electrodes Warped Substrate Contact
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Solution Overview
Problem
Warped substrates often fail to maintain close contact with flat electrostatic chucks, leading to deteriorated in-plane uniformity during substrate processing due to non-conforming surfaces, which existing electrostatic chucks cannot effectively address.
Innovation Solution
An electrostatic chuck with a plurality of electrodes arranged radially and circumferentially, controlled by a controller to adjust the timing of applying a DC voltage for optimal contact with warped substrates, ensuring close and uniform contact through precise voltage application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a flat electrostatic chuck surface is used, then the structure is simple and easy to manufacture, but warped substrates cannot maintain close contact leading to deteriorated in-plane uniformity
Solution Approach 1:
The electrostatic chuck surface is divided into multiple regions (first through fourth regions) with different electrode arrangements. Each region has electrodes configured to handle specific warpage patterns, allowing the system to address complex substrate deformation through localized segmented control rather than a single uniform structure
Solution Approach 2:
Different regions of the electrostatic chuck have different electrode configurations optimized for local substrate conditions. The first and second regions have electrodes arranged to handle warpage in one direction, while the third and fourth regions have electrodes arranged for warpage in another direction, providing locally optimized contact for different areas of the substrate
2Reliability
If electrodes are arranged in multiple radially and circumferentially defined regions, then contact with warped substrates is improved, but the device complexity increases
Solution Approach 1:
The electrode system is segmented into multiple independently controllable regions arranged radially and circumferentially. This segmentation allows each region to be controlled independently to adapt to different warpage patterns, improving reliability through localized adjustment while maintaining manageable complexity through modular region design
Solution Approach 2:
The electrostatic chuck employs dynamic voltage control where DC voltages are applied to different electrode regions at different timings based on detected substrate warpage. This dynamic adaptation allows the system to maintain reliable contact with warped substrates by adjusting electrode activation sequences rather than relying solely on static structural complexity
3Force
If DC voltage is applied to all electrodes simultaneously, then the attraction force is maximized, but non-uniform contact with warped substrates reduces processing uniformity
Solution Approach 1:
Instead of simultaneous voltage application, the system uses dynamic sequential voltage application where DC voltages are applied to different electrode regions at different timings based on substrate warpage detection. This dynamic control maintains strong overall attraction force while ensuring uniform contact by activating electrodes in the optimal sequence for the specific substrate shape
Solution Approach 2:
The system performs preliminary detection of substrate warpage before voltage application and uses this information to determine the optimal voltage application timing for each electrode region. This preliminary action allows the system to prepare the electrode activation sequence in advance, ensuring both strong attraction force and uniform contact from the start of processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables improved contact between the substrate and the electrostatic chuck, enhancing in-plane uniformity and stable attraction of warped substrates, thereby improving the effectiveness of substrate processing.
Implementation Method 1
When a DC voltage is applied to the electrode, an electrostatic attractive force is generated between the substrate and the electrostatic chuck. Thus, the substrate is attracted to the electrostatic chuck by the electrostatic attractive force and held on the supporting table by the electrostatic chuck.
Data Source
AI summary
An electrostatic chuck includes a plurality of electrodes configured to generate an electrostatic force for attracting and holding a substrate and a surface on which the substrate is to be mounted. The electrodes are arranged respectively in multiple regions radially and circumferentially defined in the electrostatic chuck. Further, a substrate processing apparatus includes an electrostatic chuck including a plurality of electrodes configured to generate an electrostatic force for attracting and holding a substrate and a surface on which the substrate is to be mounted; and a controller configured to control a timing of applying a DC voltage to each of the electrodes. Each of the electrodes generates an electrostatic force for attracting and holding the substrate by the DC voltage applied thereto, and the electrodes are arranged respectively in multiple regions radially and circumferentially defined in the electrostatic chuck.