Electrostatic Chuck Radial Temperature Control via Segmented Heaters
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Solution Overview
Problem
Existing processing apparatuses for semiconductor devices have limited temperature control and distribution capabilities for electrostatic chucks, with narrow ranges of settable temperatures and temperature increase/decrease rates, and difficulty in achieving varying temperature distributions in the radial direction.
Innovation Solution
A processing apparatus with a pedestal featuring a metal cooling table and an electrostatic chuck, where multiple heaters are coaxially positioned and separated heat transfer spaces are used, connected to a piping system with valves to control the flow of a refrigerant or heat transfer gas, allowing for adjustable thermal resistance and temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If multiple heaters are provided in the electrostatic chuck to adjust temperature distribution, then temperature distribution control is improved, but device complexity increases
Solution Approach 1:
The electrostatic chuck is divided into multiple radial regions (first, second, and third regions from center to periphery), with separate heaters provided in each region. This segmentation allows independent temperature control of different radial zones, enabling flexible temperature distribution adjustment without requiring a single complex heating system.
Solution Approach 2:
Different heaters are configured with different heating capabilities in different radial regions of the electrostatic chuck. The first heater in the central region, second heater in the intermediate region, and third heater in the peripheral region can be controlled independently to create customized temperature distributions across the chuck surface, achieving local quality optimization.
2Temperature
If thermal insulation members are added between cooling table and main body to increase thermal insulation, then main body temperature can be set high, but device complexity increases
Solution Approach 1:
A thermal insulation member is introduced as an intermediary between the cooling table and the main body. This intermediary component provides thermal insulation, allowing the main body to be heated to high temperatures while the cooling table remains cool, without requiring complex integrated thermal management systems.
3Strength
If the cooling table and electrostatic chuck are bonded by adhesive agent, then structural integrity is improved, but temperature control range is limited
Solution Approach 1:
The adhesive agent is removed from the bonding interface between the cooling table and electrostatic chuck. Instead of using adhesive, the components are mechanically connected, which eliminates the temperature limitations imposed by adhesive materials and enables wide temperature control ranges while maintaining structural integrity through mechanical means.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a wide range of settable temperatures and temperature increase/decrease rates, as well as customizable temperature distributions in the radial direction, reducing power consumption and enhancing temperature uniformity and control.
Implementation Method 1
A passage for a refrigerant is formed in the cooling table
Implementation Method 2
The piping system includes a plurality of valves which selectively connect a chiller unit
Implementation Method 3
A plurality of heaters are provided in the plurality of regions, respectively
Implementation Method 4
The plurality of heat transfer spaces extend below the plurality of regions, respectively
Implementation Method 5
The piping system includes a plurality of valves which selectively connect a gas source of a heat transfer gas
Data Source
AI summary
A processing apparatus has a pedestal which includes an electrostatic chuck and a cooling table. A plurality of heat transfer spaces are provided between the electrostatic chuck and the cooling table. The plurality of heat transfer spaces are coaxially provided with respect to the center axis of the electrostatic chuck and are separated from each other. The processing apparatus further includes a piping system. The piping system is configured to selectively connect each of the plurality of heat transfer spaces to a chiller unit, a source of a heat transfer gas, and an exhaust device.