Electrostatic Chuck Socket Design for Voltage Endurance
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Solution Overview
Problem
The substrate temperature adjusting-fixing device faces issues with voltage endurance and thermal stress, leading to potential electric discharge and inadequate substrate contact due to the thickness of the adhesive and insulating layers, which affects temperature distribution and etching rates.
Innovation Solution
The device incorporates a power supplying portion with a reduced insulating layer thickness and a sealing portion to prevent electric discharge, using a space between the adhesive layer and the socket, and a polka-dot pattern on the base body to enhance substrate contact, while maintaining high voltage endurance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the adhesive layer thickness is increased to fix the electro static chuck, then the mechanical strength and fixation stability are improved, but thermal stress increases and voltage endurance decreases leading to electric discharge
Solution Approach 1:
The patent introduces a socket as an intermediary component between the base plate and the electro static chuck base body. The socket contains the power supplying portion and provides a dedicated pathway for electrical connections, mediating between the mechanical fixation requirement and the electrical insulation requirement. This allows the adhesive layer to be optimized for mechanical strength while the socket handles the electrical isolation function.
Solution Approach 2:
The patent segments the fixation and electrical connection functions into separate components: the base plate with socket for mechanical fixation and electrical connection, and the electro static chuck base body for the electrostatic function. This segmentation allows each component to be optimized independently - the base plate can use thicker adhesive for stable fixation while the socket provides the necessary electrical isolation pathway.
2Reliability
If the insulating layer thickness is increased to prevent electric discharge, then the voltage endurance is improved, but thermal stress increases affecting temperature distribution
Solution Approach 1:
The socket acts as an intermediary that provides the necessary electrical isolation without requiring a thick insulating layer in the thermal path. By containing the power supplying portion within the socket structure, adequate electrical isolation is achieved while minimizing the insulating layer thickness in areas critical for thermal conduction to the substrate.
Solution Approach 2:
The patent applies insulating measures locally where electrical isolation is most critical (within the socket structure surrounding the power supplying portion) rather than uniformly throughout the entire assembly. This allows adequate voltage endurance at the electrical connection points while maintaining better thermal distribution in the substrate contact areas.
3Strength
If the adhesive layer thickness is increased to ensure stable fixation, then the mechanical strength is improved, but thermal stress increases leading to inadequate substrate contact
Solution Approach 1:
The patent separates the fixation function (base plate with socket) from the substrate contact function (electro static chuck base body). This allows the adhesive layer in the base plate to be optimized for mechanical strength without compromising substrate contact quality, as the electro static chuck base body directly contacts the substrate with its own optimized surface.
Solution Approach 2:
The socket serves as an intermediary that absorbs the mechanical fixation requirements, allowing the electro static chuck base body to focus on providing optimal substrate contact. The socket's structure accommodates the power supplying portion and provides electrical isolation, mediating between the base plate and the electro static chuck.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces thermal stress, prevents electric discharge, and ensures stable substrate contact and temperature distribution, improving the device's performance across varying ambient temperatures.
Implementation Method 1
an electro static chuck configured to attract and hold an attractable object onto a base body of the electro static chuck having an electrode which is built in the base body by applying a voltage to the electrode
Data Source
AI summary
A disclosed substrate temperature adjusting-fixing device includes an electro static chuck attracting and holding an attractable object onto a base body having a built-in electrode by applying a voltage to the electrode, a base plate fixing the electro static chuck via an adhesive layer, a power supplying portion electrically connected to the electrode, and a retaining portion holding the power supplying portion, wherein the retaining portion includes a main body and a sealing portion, the main body is fixed to the base plate and has recesses opened on an opposite side of the adhesive layer and a through hole penetrating through the main body, the power supplying portion includes an electrode pin and an electric wire, the electric wire is wired inside the adhesive layer, the through hole and the recesses to electrically connect the electrode with the electrode pin, and the sealing portion fills the recesses.