Electrostatic Chuck Surface Layer for Dielectric Strength and Film Hold

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing vacuum deposition methods face challenges in achieving both attractive force and dielectric strength between a cooling roller and a raw material film, leading to potential damage from electrical discharge and thermal deformation.

Innovation Solution

A vacuum treatment apparatus with a dielectric surface layer on a conductor base, having specific thickness and surface roughness, along with a neutralization unit to suppress electrification, enhances adhesive force and dielectric strength, and includes a configuration for dual-sided coating deposition.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the thickness of the insulation layer on the cooling roller surface is increased to increase dielectric strength, then dielectric strength is improved, but the coating becomes more fragile and may crack or peel, decreasing attractive force

Engineering Contradiction:
Improvedielectric strengthVSAvoidattractive force
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent optimizes the thickness parameter of the insulation layer to a specific range (50-200 μm) rather than simply increasing it. This parameter change balances dielectric strength requirements with coating integrity, preventing cracking and peeling while maintaining sufficient attractive force for electrostatic adhesion.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If a thermally sprayed insulation layer is used on the cooling roller, then dielectric strength is improved, but electrical discharge may occur at sites with lower dielectric strength, causing raw material film damage

Engineering Contradiction:
Improvedielectric strengthVSAvoidelectrical discharge damage
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent specifies an optimized thickness range (50-200 μm) for the thermally sprayed insulation layer that ensures sufficient dielectric strength to prevent electrical discharge while avoiding excessive thickness that would cause coating fragility. This parameter optimization eliminates the harmful effect of electrical discharge damage to the raw material film.

Inventive Principle:
Principle #35Parameter changes

3Force

If DC voltage is applied between the cooling roller and auxiliary roller to generate electrostatic attractive force, then attractive force is improved, but dielectric breakdown may occur, decreasing adhesive force

Engineering Contradiction:
Improveattractive forceVSAvoidadhesive force
Core Design Contradiction:
ForceVSReliability

Solution Approach 1:

The patent optimizes the insulation layer thickness (50-200 μm) to prevent dielectric breakdown when DC voltage is applied. This parameter change ensures that the insulation layer can withstand the electric field stress while maintaining sufficient electrostatic attractive force for adhesion, thus preventing loss of adhesive force due to dielectric breakdown.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves both attractive force and dielectric strength, preventing thermal deformation and electrical discharge, allowing for high-quality, high-speed coating deposition on both sides of a film.

Implementation Method 1

an insulation layer provided on the outer circumferential surface of the cooling roller... generate an electrostatic attractive force between the metal coating on the raw material film and the cooling roller

Methodology Applied
Scientific EffectElectrostatic attraction: Electrostatics

Implementation Method 2

cooling the raw material film made to adhere to the circumferential surface of the cooling roller to prevent thermal deformation of the raw material film during vapor deposition

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

vapor-depositing an evaporated material from an evaporation source disposed facing the cooling roller onto a raw material film

Methodology Applied
Scientific EffectVapor deposition: Physical Vapour Deposition

Data Source

PatentEP4678783A1Vacuum treatment device, electrostatic chuck, and transport roller
Publication Date: 2026.01.14 ULVAC INC
  • EP4678783A1 patent drawingFigure 1
  • EP4678783A1 patent drawingFigure 2~3
  • EP4678783A1 patent drawingFigure 4~6

AI summary

A vacuum treatment apparatus according to an embodiment of the present invention includes a vacuum chamber, a support, and a surface treatment means. The support includes a base part and a surface layer. The base part is disposed inside the vacuum chamber and constituted by a conductor. The surface layer is constituted by a dielectric and covers a surface of the base part. The surface layer includes a support surface that electrostatically attracts a base that is a treatment target. The surface treatment means treats a surface of the base attracted to the support surface. The surface layer has a thickness of 200 µm or more and 800 µm or less, and the support surface has surface roughness (Ra) of 0.06 µm or more and 0.2 µm or less and a profile bearing length ratio at a section level of 50% or more is 90% or more.