Electrostatic Chuck Temperature Uniformity Control
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Solution Overview
Problem
Substrate processing systems face challenges in maintaining uniform temperatures due to variations in the manufacturing process, leading to non-uniformities in substrate temperatures, which can affect the quality of processed substrates.
Innovation Solution
A system with a combination of macro and micro thermal control elements within the electrostatic chuck, where macro elements control overall zone temperatures and micro elements compensate for local non-uniformities, using stored data to adjust power distribution to achieve precise temperature setpoints across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single thermal control element is used to control overall zone temperature, then the overall temperature setpoint can be maintained, but temperature non-uniformities across the substrate cannot be compensated
Solution Approach 1:
The thermal control system is segmented into multiple independent thermal control elements (first TCEs for overall zone control, second TCEs for local compensation) distributed across the electrostatic chuck. Each element can be independently controlled to address different spatial temperature requirements, resolving the contradiction between maintaining overall temperature setpoint and achieving local temperature uniformity.
Solution Approach 2:
Different regions of the electrostatic chuck are assigned different thermal control functions: first TCEs handle bulk temperature control while second TCEs provide localized temperature compensation. This local quality differentiation allows simultaneous achievement of overall temperature control and local uniformity correction.
2Manufacturing precision
If multiple thermal control elements are used to compensate for local non-uniformities, then temperature uniformity improves, but system complexity increases
Solution Approach 1:
The system divides thermal control into hierarchical segments: first TCEs for macroscopic zone control and second TCEs for microscopic local compensation. This segmentation allows complex temperature control to be broken down into manageable independent control loops, reducing the practical complexity despite multiple elements.
Solution Approach 2:
The system uses a distributed array of second TCEs that provides more compensation capability than strictly necessary, allowing selective activation of only those elements needed for specific non-uniformity patterns. This partial action approach manages complexity by activating only required control elements.
3Manufacturing precision
If thermal control elements are added to compensate for manufacturing non-uniformities, then substrate processing quality improves, but energy consumption increases
Solution Approach 1:
Energy is applied locally only where temperature non-uniformities exist rather than uniformly across the entire electrostatic chuck. The second TCEs are activated selectively based on measured non-uniformity patterns, consuming energy only in regions that require compensation, thus improving substrate quality while minimizing additional energy consumption.
Solution Approach 2:
The system uses temperature sensors to measure actual temperature distribution and feeds this information back to the control system. Based on this feedback, the second TCEs are activated only in regions with detected non-uniformities, optimizing energy consumption by applying thermal compensation only where and when needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures accurate and uniform temperature control across the substrate, compensating for manufacturing-induced non-uniformities, thereby improving the consistency and quality of substrate processing.
Implementation Method 1
The wafer processing substrate includes at least one first thermal control element arranged within the wafer processing substrate and a plurality of second thermal control elements arranged throughout the wafer processing substrate
Implementation Method 2
calculates second data indicative of temperature non-uniformities associated with the wafer processing substrate based on the first data and the second value, and controls the plurality of second thermal control elements based on the calculated second data
Data Source
AI summary
A system for controlling a temperature of a wafer processing substrate includes memory that stores first data indicative of first temperature responses of at least one first thermal control element. The first data corresponds to the first temperature responses as observed when a first control parameter of the at least one first thermal control element is maintained at a first predetermined first value. A first controller receives a setpoint temperature for the wafer processing substrate and maintains the first control parameter of the at least one first thermal control element at a second value based on the received setpoint temperature. A second controller retrieves the first data from the memory, calculates second data indicative of temperature non-uniformities associated with the wafer processing substrate based on the first data and the second value, and controls a plurality of second thermal control elements based on the calculated second data.