Electrostatic Chuck Heater Array for Sensorless Temperature Mapping
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Temperature variations during semiconductor and micromechanical substrate processing can lead to inconsistent results and inoperable structures, as existing methods rely on external sensors that increase complexity and cost, and require additional space for wiring and control systems.
Innovation Solution
An array of heater elements integrated into the substrate carrier, which function as both heating and temperature-sensing devices, allowing for independent temperature measurements across the substrate, enabling precise temperature control and elimination of external sensors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If external temperature sensors are used to measure substrate temperature, then temperature measurement capability is provided, but device complexity and cost increase due to additional sensors, wiring, and control systems
Solution Approach 1:
The heater elements are designed to serve dual functions: heating the substrate during processing and sensing temperature through resistance measurements. By making the heating elements multi-functional, the patent eliminates the need for separate temperature sensors, thereby reducing device complexity while maintaining temperature measurement capability.
Solution Approach 2:
The heater elements perform self-diagnosis by measuring their own resistance to determine temperature. This self-service approach allows the heating elements to provide temperature feedback without requiring external sensing components, simplifying the overall system architecture.
2Measurement precision
If external temperature sensors are installed on the substrate, then temperature monitoring is enabled, but additional space is required for wiring and control systems
Solution Approach 1:
The heater elements are designed to serve dual functions: heating the substrate during processing and sensing temperature through resistance measurements. By making the heating elements multi-functional, the patent eliminates the need for separate temperature sensors, thereby reducing device complexity while maintaining temperature measurement capability.
Solution Approach 2:
The temperature sensing function is merged with the heating function by using the same heater elements for both purposes. This consolidation integrates temperature monitoring capabilities directly into the existing heating structure, eliminating the need for separate sensing components and their associated wiring space.
3Measurement precision
If temperature measurements are taken during processing, then real-time temperature control is achieved, but processing time increases due to measurement cycles
Solution Approach 1:
The heater elements are designed to serve dual functions: heating the substrate during processing and sensing temperature through resistance measurements. By making the heating elements multi-functional, the patent eliminates the need for separate temperature sensors, thereby reducing device complexity while maintaining temperature measurement capability.
Solution Approach 2:
The heater elements continuously provide both heating and temperature sensing functions simultaneously during processing, rather than alternating between heating and measurement modes. This continuous dual-function operation eliminates measurement cycle interruptions, maintaining uninterrupted processing while providing real-time temperature data.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides accurate, real-time temperature measurements and control, reducing temperature variations and improving process precision without the need for external sensors, thus enhancing the reliability and efficiency of semiconductor and micromechanical substrate processing.
Implementation Method 1
measuring a first combined current load of each of a plurality of heating elements in the electrostatic chuck
Implementation Method 2
determining the difference between the first and second combined current loads, determining a temperature of the first heating element using the difference
Data Source
AI summary
Temperature measurement is described for a substrate carrier using a heater element array. In one example a method includes measuring a first combined current load of each of a plurality of heating elements in the electrostatic chuck, changing a power status of a first heating element of the plurality of heating elements, measuring a second combined current load of each of the plurality of heating elements after changing the power status of the first heating element, determining the difference between the first and second combined current loads, determining a temperature of the first heating element using the difference, and reverting the power status of the first heating element to that before the change and repeating changing power, measuring a current load, determining a difference, and determining a temperature for each of the other heating elements of the plurality to determine a temperature at each of the heating elements of the plurality.