Electrostatic Chuck Terminal Merging for Temperature Uniformity
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Solution Overview
Problem
Conventional electrostatic chucks for semiconductor wafers face challenges in achieving uniform temperature distribution due to complex structures and increased thermal singularities caused by multiple heater electrode terminals and terminal holes, leading to reduced manufacturing efficiency and adhesion performance.
Innovation Solution
An electrostatic chuck design featuring a ceramic body substrate with multiple heating regions, where heater electrode terminals are collectively connected through a single internal through hole, reducing the number and area of terminal holes and simplifying the structure, thereby improving temperature uniformity and manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple heater electrode terminals and terminal holes are provided to enable independent temperature control in each heating region, then temperature control precision is improved, but device complexity increases and thermal singularities occur
Solution Approach 1:
Multiple heater electrode terminals are merged into a single through-hole structure. The patent integrates multiple terminal connections within one through-hole, eliminating the need for multiple separate terminal holes in the substrate, thereby reducing structural complexity while maintaining independent temperature control capability
Solution Approach 2:
The patent transitions from a two-dimensional arrangement of multiple terminal holes to a three-dimensional structure where multiple terminals are stacked or arranged within a single through-hole, utilizing the vertical dimension to resolve the contradiction between terminal quantity and structural simplicity
2Reliability
If multiple terminal holes are formed in the metal base, then heater electrode terminals can be connected, but heat dissipation performance deteriorates and thermal singularities are generated
Solution Approach 1:
Multiple terminal connections are merged into a single through-hole structure in the metal base, eliminating multiple hole formations that disrupt heat dissipation pathways. This maintains thermal conductivity and prevents localized heat accumulation while ensuring reliable terminal connections
3Reliability
If multiple terminal holes are provided for heater electrode terminals, then electrical connection is enabled, but adhesion performance between body substrate and metal base deteriorates
Solution Approach 1:
Multiple terminal connections are consolidated into a single through-hole structure, reducing the total number of holes that compromise adhesion. This minimizes the disruption to the bonding interface between the body substrate and metal base while maintaining reliable electrical connections for all heater electrodes
4Measurement precision
If the number of heater electrode terminals increases, then independent temperature control in each region is achieved, but manufacturing efficiency decreases due to increased processing steps
Solution Approach 1:
Multiple terminal connections are merged into a single through-hole structure, reducing the number of hole formation steps, filling operations, and connection processes. This significantly decreases manufacturing complexity and improves production efficiency while maintaining the capability for independent temperature control in each heating region
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The simplified structure enhances temperature distribution uniformity, reduces thermal singularities, and improves manufacturing efficiency by decreasing processing steps and adhesion performance, while maintaining high corrosion resistance for plasma etching applications.
Implementation Method 1
The semiconductor wafer is heated by the heater electrode
Implementation Method 2
an electrostatic chuck which supports a semiconductor wafer by means of electrostatic attraction force
Data Source
AI summary
An electrostatic chuck includes: a body substrate having a substrate front surface and a substrate rear surface and made of ceramic; an attraction electrode provided in the body substrate; a metal base having a base front surface and a base rear surface, and placed such that the base front surface faces the substrate rear surface of the body substrate; and an internal through hole formed so as to penetrate the base front surface and the base rear surface of the metal base. The body substrate has a plurality of heating regions in each of which a heater electrode is provided. In the internal through hole, a plurality of heater electrode terminals are provided which are electrically connected to the heater electrode in each heating region. The plurality of heater electrode terminals provided in the internal through hole are electrically connected to a connection member provided in the internal through hole.