Electrostatic Chuck Power Terminal Layout for Thermal Stress Relief

Solution Overview

Problem

Existing substrate support systems face challenges in stably supplying power to electrodes due to thermal expansion differences between conductive and insulating materials, leading to internal stress and deterioration of conductive adhesives, especially under varying temperature conditions.

Innovation Solution

A substrate support system with a power supply terminal that is movable and not fixed to the electrode contact portion, using an insulating adhesive layer and a through-hole design to prevent stress buildup, ensuring stable power supply even with thermal expansion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a power supply terminal is fixed to the electrode contact portion using conductive adhesive, then electrical connection is established, but internal stress builds up due to thermal expansion differences causing adhesive deterioration

Engineering Contradiction:

Improvepower supply stabilityVSAvoidadhesive bonding strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The power supply terminal is designed to be movable rather than fixed, allowing it to move in response to thermal expansion and contraction of the electrostatic chuck. This dynamic design prevents internal stress buildup that would occur with a fixed connection, thereby avoiding adhesive deterioration while maintaining reliable electrical connection.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The connection system is divided into two functional parts: a movable power supply terminal for electrical connection and a separate adhesive layer for mechanical bonding. This segmentation allows each component to perform its specific function independently, with the adhesive providing structural support and the movable terminal accommodating thermal expansion without stress transmission to the adhesive.

Inventive Principle:

Principle #1Segmentation

2Strength

If the electrostatic chuck is bonded to the base with adhesive, then mechanical support is provided, but thermal expansion differences cause internal stress and adhesive deterioration

Engineering Contradiction:

Improvebonding strengthVSAvoidconnection stability under temperature cycles

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The power supply terminal is designed to be movable rather than fixed, allowing it to move in response to thermal expansion and contraction of the electrostatic chuck. This dynamic design prevents internal stress buildup that would occur with a fixed connection, thereby avoiding adhesive deterioration while maintaining reliable electrical connection.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The connection system is divided into two functional parts: a movable power supply terminal for electrical connection and a separate adhesive layer for mechanical bonding. This segmentation allows each component to perform its specific function independently, with the adhesive providing structural support and the movable terminal accommodating thermal expansion without stress transmission to the adhesive.

Inventive Principle:

Principle #1Segmentation

3Power

If the power supply terminal contacts the electrode, then power is supplied, but fixing the terminal causes stress buildup during thermal cycles

Engineering Contradiction:

Improvepower supply capabilityVSAvoidinternal stress

Core Design Contradiction:

PowerVSStress or pressure

Solution Approach 1:

The power supply terminal is designed to be movable rather than fixed, allowing it to move in response to thermal expansion and contraction of the electrostatic chuck. This dynamic design prevents internal stress buildup that would occur with a fixed connection, thereby avoiding adhesive deterioration while maintaining reliable electrical connection.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution allows for stable power supply to the electrode by eliminating internal stress and adhesive deterioration, maintaining contact integrity across temperature cycles.

Implementation Method 1

an electrostatic chuck on which a substrate is placed; an electrode provided in the electrostatic chuck

Methodology Applied

Scientific EffectElectrostatic attraction: Electrostatics

Data Source

PatentUS12165896B2Substrate support and substrate processing apparatus

Publication Date: 2024.12.10 TOKYO ELECTRON LTD

AI summary

A substrate support is provided that includes: a base; an electrostatic chuck on which a substrate is placed; an electrode provided in the electrostatic chuck; a contact portion of the electrode; an adhesive layer that bonds the electrostatic chuck with the base and that does not cover the contact portion; and a power supply terminal contacting the contact portion of the electrode without being fixed to the contact portion.