Electrostatic Chuck Thermal Conduction Unit for Uniform Substrate Heating
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Solution Overview
Problem
The existing electrostatic chucks used in semiconductor and flat panel display manufacturing face challenges in uniformly heating substrates due to the low thermal conductivity of ceramic-based insulating materials and coil-patterned heaters, leading to temperature deviations that affect the quality of thin film deposition and etching processes.
Innovation Solution
Incorporating a thermal conduction unit with high thermal conductivity materials, such as metallic or metal alloy plates, between the direct current electrode and the heating/cooling units within the insulating plate to uniformly diffuse heat and maintain temperature control across the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ceramic-based insulating materials are used in the electrostatic chuck, then electrical insulation is improved, but thermal conductivity deteriorates leading to temperature deviations
Solution Approach 1:
The patent employs a composite structure combining ceramic insulating plate with metal thermal conduction plates. The ceramic plate provides electrical insulation while the metal plates (aluminum or copper) provide high thermal conductivity. This composite approach allows the system to simultaneously achieve both electrical insulation and thermal uniformity across the substrate surface.
Solution Approach 2:
The thermal conduction plates serve as intermediary elements between the heating/cooling units and the substrate. These metal plates conduct heat uniformly across their surfaces and transfer it to the substrate through contact points, mediating the thermal transfer process to eliminate temperature deviations caused by the ceramic material's low thermal conductivity.
2Use of energy by moving object
If coil-patterned heaters are used for heating, then heating function is achieved, but temperature uniformity deteriorates due to low thermal conductivity of ceramic material
Solution Approach 1:
The thermal conduction plates act as intermediaries that receive heat from the coil-patterned heaters and redistribute it uniformly across the substrate surface. The metal plates' high thermal conductivity allows them to equalize temperature variations caused by the localized heating coils, providing uniform thermal distribution despite the simple coil heater structure.
Solution Approach 2:
The patent changes the thermal conductivity parameter by introducing metal plates with high thermal conductivity into the system. This parameter change transforms the thermal distribution characteristic from non-uniform (due to ceramic material) to uniform (through metal conduction), while maintaining the original coil heater configuration.
3Device complexity
If simple heating and cooling units are used, then device complexity is reduced, but temperature control precision deteriorates
Solution Approach 1:
The thermal conduction plates serve as passive intermediary components that enhance temperature control precision without adding active control elements. By simply introducing these high-conductivity metal plates between the heating/cooling units and the substrate, the system achieves better temperature uniformity and control precision while maintaining relatively simple device structure.
Solution Approach 2:
The patent improves temperature control precision by changing the thermal conductivity parameter of the intermediate materials. The metal plates' high thermal conductivity parameter enables more precise and uniform temperature distribution across the substrate, enhancing manufacturing precision without significantly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures uniform heating and cooling of the substrate, improving the quality of thin film deposition and etching processes by minimizing temperature deviations and enhancing thermal conductivity.
Implementation Method 1
a thermal conduction unit disposed between the electrode and the temperature controlling unit
Implementation Method 2
The electrostatic chuck fixes the substrate thereon using an electrostatic power
Data Source
AI summary
An electrostatic chuck for an apparatus for treating a substrate includes a body; an insulating plate attached onto a top surface of the body, wherein the substrate is disposed on the insulating plate; an electrode in the insulating plate; a temperature controlling unit including a heating unit and a cooling unit under the electrode and in the insulating plate; and a thermal conduction unit disposed between the electrode and the temperature controlling unit.