Electrostatic Chuck Assembly Without Organic Bonding for Thermal Cycling

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Solution Overview

Problem

Conventional electrostatic chucks used in semiconductor manufacturing are unsuitable for high temperature applications due to the degradation of bonding materials under thermal cycling, leading to performance issues and laborious plate replacement processes.

Innovation Solution

A substrate support assembly with a chuck and a cooling plate, where the chuck is electrostatically secured using clamp electrodes, allowing for high temperature and low temperature applications, and featuring a dielectric material with similar thermal expansion coefficients to minimize stress and degradation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If organic bonding material is used to bond ceramic body to metal cooling plate, then assembly is simplified, but power dissipation capability deteriorates for high temperature processes

Engineering Contradiction:

Improveassembly structureVSAvoidpower dissipation capability

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The patent removes the organic bonding material from the assembly, extracting the problematic element that limited temperature capability. The ceramic electrostatic chuck is directly bonded to the metal cooling plate without organic intermediaries, enabling high temperature operation while maintaining assembly simplicity through direct bonding.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent employs composite material construction by directly bonding ceramic electrostatic chuck to metal cooling plate, creating a composite structure that combines the electrical insulation properties of ceramic with the thermal management capabilities of metal, achieving both structural simplicity and high temperature capability.

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If conventional bonding materials are used, then plates can be bonded together, but degradation occurs under thermal cycling leading to arcing

Engineering Contradiction:

Improvebonding processVSAvoidresistance to thermal degradation

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent extracts and eliminates the organic bonding material that caused degradation under thermal cycling. By removing this vulnerable component, the system achieves reliable operation under thermal stress while maintaining ease of manufacture through direct bonding of ceramic to metal surfaces.

Inventive Principle:

Principle #2Taking out (Extraction)

3Reliability

If plates are replaced when degraded, then performance is maintained, but manufacturing efficiency deteriorates due to time-consuming replacement process

Engineering Contradiction:

Improveperformance maintenanceVSAvoidmanufacturing efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent applies prior cushioning by designing a bonding structure that is inherently resistant to thermal degradation from the outset. The direct bonding of ceramic to metal without organic intermediaries prevents the degradation that would otherwise necessitate replacement, thereby maintaining reliability while eliminating downtime and preserving manufacturing efficiency.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

4Stability of the object's composition

If stress from thermal cycling is accommodated, then bonding durability improves, but material selection becomes more constrained

Engineering Contradiction:

Improvebonding durabilityVSAvoidmaterial selection flexibility

Core Design Contradiction:

Stability of the object's compositionVSAdaptability or versatility

Solution Approach 1:

The patent applies homogeneity by using materials with matched thermal expansion coefficients - the ceramic electrostatic chuck and metal cooling plate are selected to have compatible thermal properties. This homogeneous thermal behavior accommodates thermal cycling stress while maintaining bonding durability, and the direct bonding approach actually increases material selection flexibility compared to being constrained by available organic bonding materials.

Inventive Principle:

Principle #33Homogeneity

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The assembly enables efficient and reliable substrate holding across a wide temperature range with reduced degradation and simplified plate replacement, enhancing semiconductor manufacturing efficiency.

Implementation Method 1

one or more electrodes embedded within a unitary chuck body, which includes a dielectric or semi-conductive ceramic material across which an electrostatic clamping field can be generated to chuck a substrate

Methodology Applied

Scientific EffectElectrostatic clamping field: Electrostatics

Implementation Method 2

Heating elements may be included in the electrostatic chucks to heat a supported substrate

Methodology Applied

Scientific EffectHeating: Heating

Data Source

PatentUS12512358B2Electrostatically secured substrate support assembly

Publication Date: 2025.12.30 APPLIED MATERIALS INC

AI summary

A substrate support assembly includes a cooling plate and a chuck disposed on the cooling plate. The chuck includes one or more heating electrodes, and one or more clamp electrodes to electrostatically secure the chuck to the cooling plate. Another substrate support assembly includes a cooling plate, a first puck plate bonded to the cooling plate, and a second puck plate disposed on the first puck plate. The second puck plate includes one or more clamp electrodes to electrostatically secure the second puck plate to the first puck plate.