Electrostatic Chuck Structure for High-Temperature Thermal Stress Relief
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Solution Overview
Problem
Conventional electrostatic chucks face operational issues in high-temperature environments due to thermal expansion, which can cause damage and reduce their effectiveness in semiconductor and display device processing.
Innovation Solution
An electrostatic chuck design featuring a cooling plate with a flow path, an insulating plate to inhibit thermal expansion, and a fastening member that constrains movement in specific directions to alleviate stress, preventing cracks and ensuring durability at high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high processing temperatures are used to enhance etch selectivity and increase volatility of film etching by-products, then pattern formation capability is improved, but thermal expansion causes damage and reduces operability of conventional electrostatic chucks
Solution Approach 1:
The electrostatic chuck is divided into multiple functional layers: a lower plate, an insulating plate, and an upper plate. This segmentation allows each layer to perform its specific function independently - the lower plate provides structural support, the insulating plate prevents thermal expansion, and the upper plate maintains electrostatic functionality, thereby resolving the contradiction between high-temperature processing and chuck reliability
Solution Approach 2:
An insulating plate is introduced as an intermediary layer between the lower plate and upper plate. This intermediary component specifically addresses the thermal expansion problem by providing thermal insulation, allowing the upper plate to maintain its electrostatic function at high temperatures without being affected by thermal expansion, thus enabling both high productivity and reliability
2Ease of manufacture
If conventional electrostatic chuck structures are used in high-temperature environments, then manufacturing simplicity is maintained, but thermal expansion causes cracks and reduces durability
Solution Approach 1:
The chuck structure is segmented into distinct plates (lower plate, insulating plate, upper plate) that can be manufactured separately using standard processes and then assembled. This maintains ease of manufacture while the specific segmentation provides thermal management capabilities that prevent cracks and improve durability at high temperatures
Solution Approach 2:
The electrostatic chuck uses a composite structure combining different materials with complementary properties: the lower plate provides mechanical strength, the insulating plate provides thermal insulation, and the upper plate provides electrostatic function. This composite approach maintains manufacturing simplicity through standardized components while dramatically improving high-temperature durability
3Stability of the object's composition
If the upper plate is rigidly fixed to prevent any movement, then structural stability is improved, but thermal stress increases and causes cracks
Solution Approach 1:
The insulating plate serves as a mediator between the lower plate and upper plate, providing thermal isolation that reduces thermal stress transmission. This allows the upper plate to remain relatively stable for structural integrity while preventing excessive thermal stress buildup that would cause cracks, thus resolving the contradiction between stability and stress resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design allows the electrostatic chuck to operate without damage in high-temperature environments, preventing cracks and ensuring the stability of substrates during processing, thereby enhancing the reliability of semiconductor and display device manufacturing.
Implementation Method 1
a cooling plate (120) having a cooling flow path (121)
Implementation Method 2
an insulating plate (130) disposed on the cooling plate (120)
Implementation Method 3
a fastening member (150) coupling the cooling plate (120) to the upper plate (140). The fastening member (150) passes through the cooling plate (120) and is coupled to a fastening portion (142) provided on a lower surface of the upper plate (140), and movement of the fastening member (150) is constrained only in a first direction intersecting an upper surface of the upper plate (140)
Implementation Method 4
The electrostatic chuck is configured to fix the substrate in place within the chamber using electrostatic force
Data Source
AI summary
An electrostatic chuck includes a cooling plate having a cooling flow path, an insulating plate disposed on the cooling plate, an upper plate disposed on the insulating plate and fixed to the cooling plate, and a fastening member coupling the cooling plate to the upper plate. The fastening member passes through the cooling plate and is coupled to a fastening portion provided on a lower surface of the upper plate. Movement of the fastening member is constrained only in a first direction intersecting an upper surface of the upper plate.