Electrostatic Chuck Layered Structure for Thermal Warp Control
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Solution Overview
Problem
In existing electrostatic chuck assemblies, when the upper puck plate is heated from room temperature to high temperatures, the puck deforms such that its central portion becomes convex, leading to potential breakage of the composite plate due to downward pulling by fasteners.
Innovation Solution
The member for a semiconductor manufacturing apparatus includes a ceramic plate, a composite plate, a cooling plate, first and second fasteners, and a support plate. When heated, the first layered body comprising the ceramic and composite plates deforms convexly, while the second layered body comprising the cooling and support plates also deforms convexly, preventing the composite plate from being pulled downward and broken.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the cooling plate is fastened to the mounting plate using fasteners, then the cooling plate is securely mounted, but the composite plate may be pulled downward by the fasteners when heated and broken
Solution Approach 1:
The mounting structure is divided into two separate fastening systems: first fasteners connect the composite plate to the cooling plate, while second fasteners connect the cooling plate to the support plate. This segmentation isolates the stress paths, preventing the second fasteners from transmitting downward pulling forces to the composite plate while maintaining secure mounting of the cooling plate.
Solution Approach 2:
The cooling plate serves as an intermediary element between the composite plate and the support plate. By introducing this intermediate layer with its own dedicated fastening system (second fasteners), the structure allows the cooling plate to be securely mounted to the support plate without directly transmitting mounting stresses to the composite plate, thus preventing breakage.
2Temperature
If the ceramic plate is heated to high temperature, then the wafer processing function is enabled, but the puck deforms with convex central portion causing composite plate breakage
Solution Approach 1:
The thermal expansion problem is addressed by segmenting the structure into the first layered body (ceramic plate + composite plate) and the second layered body (cooling plate + support plate). Each layer is allowed to expand independently with its own fastening system, preventing stress concentration that would cause composite plate breakage during thermal cycling.
Solution Approach 2:
The invention changes the physical parameters of the layered structures by selecting materials with appropriate thermal expansion coefficients and designing the fastening systems to accommodate thermal deformation. The first and second layered bodies are designed to deform convexly together during heating, transforming the harmful differential expansion into a coordinated deformation pattern that prevents stress concentration and composite plate failure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures that the composite plate is not pulled downward by fasteners, thereby preventing breakage, and maintains structural integrity during temperature changes.
Implementation Method 1
when the ceramic plate is heated from room temperature to high temperature, a first layered body including the ceramic plate and the composite plate deforms such that a central portion of the first layered body is convex
Data Source
AI summary
A member for a semiconductor manufacturing apparatus includes a ceramic plate; a composite plate joined to a lower surface of the ceramic plate; a cooling plate formed of a metal material, disposed on a lower surface of the composite plate; a first fastener that fastens the composite plate and the cooling plate; a support plate that is formed of an insulating material and supports a lower surface of the cooling plate; and a second fastener that fastens the cooling plate and the support plate, wherein, when the ceramic plate is heated from room temperature to high temperature, a first layered body including the ceramic plate and the composite plate deforms such that a central portion of the first layered body is convex, and a second layered body including the cooling plate and the support plate deforms such that a central portion of the second layered body is convex.