Electrostatic Chuck Thin-Wall Cooling for Stable Wafer Heating
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Solution Overview
Problem
Current electrostatic chucks in semiconductor manufacturing face issues with temperature control during high-temperature processes, leading to whisker defects and reduced product yield due to direct contact between the heating body and cooling pipeline, which prevents continuous cooling liquid flow and results in ineffective heat dissipation.
Innovation Solution
An electrostatic chuck design featuring a thin-wall structure with a heat transfer plate and ring-shaped connector, spaced apart from the heating body, allows for efficient heat dissipation to a cooling pipeline, preventing boiling of cooling liquid and enabling continuous operation during high-temperature processes, thereby reducing whisker defects and improving yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the cooling pipeline is arranged in direct contact with the heating body, then heat dissipation efficiency is improved, but the cooling liquid boils during high-temperature processes
Solution Approach 1:
The patent introduces a heat transfer plate as an intermediary component between the heating body and cooling pipeline. This plate conducts heat from the heating body to the cooling liquid without allowing direct contact, preventing boiling while maintaining efficient heat dissipation. The plate acts as a mediator that enables thermal energy transfer while isolating the cooling liquid from direct exposure to high temperatures.
Solution Approach 2:
The patent segments the heat dissipation function into two separate components: the heating body and the heat transfer plate, with the cooling pipeline positioned separately. This segmentation allows the cooling liquid to remain at a lower temperature while still achieving effective heat removal through the plate intermediary, resolving the contradiction between heat dissipation efficiency and cooling liquid temperature control.
2Temperature
If the cooling pipeline is spaced apart from the heating body, then cooling liquid boiling is prevented, but heat dissipation efficiency decreases
Solution Approach 1:
The heat transfer plate serves as an efficient thermal conductor that bridges the gap between the heating body and cooling pipeline. Even though the cooling pipeline is spaced apart to prevent boiling, the plate maintains high heat dissipation efficiency by providing a direct thermal conduction path from the heating body to the cooling liquid.
Solution Approach 2:
The patent employs a thin-wall structure for the heat transfer plate, which provides excellent thermal conductivity while maintaining structural integrity across the spacing gap. The thin wall design minimizes thermal resistance, ensuring efficient heat transfer from the heating body to the cooling liquid despite the physical separation required to prevent boiling.
3Power
If direct contact between heating body and cooling pipeline is used, then heat transfer is efficient, but continuous cooling liquid flow cannot be maintained during high-temperature processes
Solution Approach 1:
The heat transfer plate enables continuous operation by mediating the heat transfer process. It allows cooling liquid to flow continuously through the pipeline at lower temperatures while still achieving efficient heat removal from the heating body, eliminating the need to stop cooling during high-temperature processes.
Solution Approach 2:
The patent achieves continuous cooling liquid flow during high-temperature processes by using the heat transfer plate intermediary. The plate maintains efficient thermal coupling between the heating body and cooling liquid, allowing the cooling system to operate continuously without interruption or boiling, thus extending the duration of useful action.
4Reliability
If cooling is stopped during high-temperature processes, then equipment safety is improved, but whisker defects increase and product yield decreases
Solution Approach 1:
The heat transfer plate allows the cooling system to remain active during high-temperature processes by preventing direct contact between cooling liquid and heating body. This continuous cooling operation maintains equipment safety while preventing whisker defects, thereby preserving product yield and productivity.
Solution Approach 2:
The patent enables continuous cooling operation during high-temperature processes through the heat transfer plate intermediary. This continuous action prevents equipment overheating and maintains product quality by avoiding whisker defects, ensuring both equipment safety and high productivity are achieved simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains stable temperature control, reducing whisker defects and enhancing product yield by allowing continuous cooling liquid flow and efficient heat dissipation, even during high-temperature processes.
Implementation Method 1
a thin-wall structure, respectively connected to the heating body and the cooling pipeline and configured to transfer the heat from the heating body to the cooling pipeline
Implementation Method 2
a cooling pipeline, arranged under the heating body, spaced apart from the heating body, and configured to transfer cooling liquid
Implementation Method 3
a heating body for providing heat to the insulating layer
Data Source
AI summary
The present disclosure provides an electrostatic chuck and a reaction chamber. The electrostatic chuck includes an insulation layer and a heating body arranged at a bottom of the insulation layer. The electrostatic chuck further includes a cooling pipeline. The cooling pipeline is arranged under the heating body, spaced apart from the heating body, and configured to transfer cooling liquid to absorb heat radiated by the heating body. The electrostatic chuck further includes a thin-wall structure respectively connected to the heating body and the cooling pipeline. The thin-wall structure is configured to reduce heat dissipation efficiency between the heating body and the cooling pipeline. The electrostatic chuck provided by the present disclosure may realize stable temperature control for the heating body during a processing process to effectively reduce whisker defects and to improve the product yield.