Electrostatic Chuck Layer Design for Thin Workpiece Release
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Solution Overview
Problem
Existing attachment and detachment devices using the electrostatic chuck method face challenges with residual charge during workpiece separation, particularly with thin workpieces like lead frames or metal foils, where slight residual charge can hinder separation.
Innovation Solution
The proposed attachment and detachment device incorporates a machinable ceramic layer, an adhesion activating layer, an electrode layer, and a dielectric layer with a volume resistivity of 10^9 to 10^12 Ω·cm, which enables effective charge neutralization and improved responsiveness for thin workpieces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the electrostatic chuck method is used to attach and detach thin workpieces, then the device can handle workpieces with holes or in vacuum environments, but residual charge remains after separation making it difficult to remove thin workpieces
Solution Approach 1:
The patent changes the electrical parameter (volume resistivity) of the dielectric layer to a specific range (10^9 to 10^12 Ω·cm) to control charge retention characteristics. This parameter optimization allows the dielectric layer to reduce residual charge while maintaining electrostatic attraction during the attached state, enabling easy separation of thin workpieces without compromising handling capability for complex workpiece types
Solution Approach 2:
The patent employs a composite structure consisting of a dielectric layer with specific volume resistivity combined with an electrostatic chuck system. This composite material approach creates a system that simultaneously provides the necessary electrostatic attraction for holding workpieces (including those with holes or in vacuum) while controlling residual charge to facilitate easy separation
2Speed
If vacuum suction is used to attach workpieces, then excellent response characteristics are achieved, but thin workpieces bend at suction points and suction marks remain
Solution Approach 1:
The patent replaces the mechanical vacuum suction system with an electrostatic chuck system that utilizes electrostatic forces for attachment. This substitution eliminates the need for physical contact and suction forces that cause bending and surface marks on thin workpieces, while maintaining excellent response characteristics through rapid voltage control
3Ease of operation
If plasma discharge or opposite voltage application is used to eliminate residual charge, then workpiece separation becomes easier, but processing speed decreases and the process becomes less practical
Solution Approach 1:
The patent incorporates the charge elimination function directly into the dielectric layer material properties (through controlled volume resistivity), so that residual charge is naturally reduced during the normal operation cycle without requiring separate plasma discharge or opposite voltage application steps. This preliminary integration of charge management into the material structure maintains high processing speed while enabling easy workpiece separation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces residual charge after voltage application is turned off, allowing for smooth separation of thin workpieces and enhancing the responsiveness of the attachment and detachment process.
Implementation Method 1
an attachment and detachment device including a machinable ceramic layer, an adhesion activating layer provided on the machinable ceramic layer, an electrode layer provided on the adhesion activating layer, and a dielectric layer provided on the electrode layer
Implementation Method 2
the dielectric layer has a volume resistivity of 10^9 to 10^12 Ω·cm
Data Source
Figure 1
Figure 2(a)~2(e)
AI summary
An attachment and detachment device that excels in responsiveness to attachment and detachment of a workpiece even when the workpiece is thin while utilizing an electrostatic chuck method is provided. The attachment and detachment device that enables suction and separation of a workpiece includes a machinable ceramic layer, an adhesion activating layer provided on the machinable ceramic layer, an electrode layer provided on the adhesion activating layer, and a dielectric layer provided on the electrode layer, wherein the electrode layer is covered with the adhesion activating layer and the dielectric layer, and the dielectric layer has a volume resistivity of 109 to 1012 Ω·cm.