Electrostatic Chuck Electrode Layout for Uniform Plasma Etching
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Solution Overview
Problem
Existing electrostatic chucks in plasma processing apparatuses suffer from non-uniformity issues due to the layout of electrodes, leading to side-to-side etch rate variations and temperature control challenges, which current solutions fail to adequately address.
Innovation Solution
A radial layout of thermally isolated and electrically connected clamping electrodes with a thermal control system and a sealing band, along with a pixelated array of micro-electrodes coupled to RF and DC power sources for independent control, to enhance uniformity and temperature control across the workpiece.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional electrode layout is used in electrostatic chuck, then device complexity is reduced, but process uniformity deteriorates due to side-to-side etch rate variations
Solution Approach 1:
The electrostatic chuck divides the electrode structure into multiple segments: a first electrode, a second electrode, and a third electrode arranged in a triangular pattern. This segmentation allows independent control of different regions to achieve uniform plasma processing while maintaining manageable device complexity through modular electrode design.
Solution Approach 2:
The patent applies local quality by creating distinct electrode zones with different potentials. The first electrode connects to a first potential, the second electrode to a second potential, and the third electrode to a third potential, allowing localized control of electric field distribution to achieve uniform etching across the substrate surface.
2Temperature
If simple electrode configuration is used, then device complexity is reduced, but temperature control precision deteriorates
Solution Approach 1:
The thermal control system is segmented into multiple heating zones corresponding to the electrode arrangement. Each electrode region has associated thermal control capabilities, allowing independent temperature management in different areas of the electrostatic chuck to achieve precise overall temperature control.
Solution Approach 2:
The system incorporates feedback mechanisms through sensors that monitor temperature and process parameters, with the controller adjusting electrode potentials and heating power accordingly to maintain optimal temperature distribution across the substrate during plasma processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved process uniformity, precise control over selected surface areas, and enhanced durability of the sealing band to prevent gas leakage, resulting in better temperature management and reduced non-uniformity during plasma processing.
Implementation Method 1
The electrostatic chuck includes a clamping layer including one or more clamping electrodes... the one or more clamping electrodes generate an electrostatic force to hold the workpiece on the workpiece support surface
Implementation Method 2
The electrostatic chuck includes one or more heating electrodes defining a heating layer... the one or more heating electrodes generate heat
Implementation Method 3
a thermal control system including one or more flow channels for circulating a thermal exchange fluid or a thermal exchange gas
Data Source
AI summary
An electrostatic chuck including a workpiece support surface, clamping layer, heating layer, thermal control system, and sealing band is disclosed. The sealing band surrounds an outer perimeter of the electrostatic chuck including at least a portion of the workpiece surface. The sealing band has a width greater than about 3 millimeters (mm) up to about 10 mm. Plasma processing apparatuses and systems incorporating the electrostatic chuck are also provided.