Electrostatic Chuck Thermal Diffusion Layer for Uniform Heating
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Solution Overview
Problem
Existing electrostatic chucks face challenges in achieving improved heat uniformity, which is required for efficient semiconductor manufacturing processes.
Innovation Solution
The electrostatic chuck incorporates a base body with a mounting face and a back face, an insulating layer on the back face, a heating element within the insulating layer, and at least one thermal diffusion layer made of a material with higher thermal conductivity than the base body, to diffuse heat uniformly across the base body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal layer is added to make heat uniform, then heat uniformity is improved, but device complexity increases
Solution Approach 1:
The thermal diffusion layer is embedded within the base body structure itself, nesting the heat-diffusing function inside the existing chuck body. This integrates the thermal management function into the core structure rather than adding separate external components, thereby improving heat uniformity while minimizing increases in overall device complexity.
Solution Approach 2:
The invention uses a composite structure where the base body is formed by combining a dielectric material with a thermal diffusion layer having different thermal conductivity properties. This composite approach allows the base body itself to perform both structural and thermal diffusion functions, improving heat uniformity without requiring separate metal layers or additional components.
2Temperature
If the base body thickness is increased to improve heat uniformity, then temperature distribution is improved, but the size of the electrostatic chuck increases
Solution Approach 1:
Instead of uniformly increasing the entire base body thickness, the invention applies a thermal diffusion layer with specific thermal conductivity properties at strategic locations within the base body. This localized approach to thermal management improves temperature distribution without requiring a proportional increase in overall chuck thickness, thus maintaining compact dimensions while achieving better heat uniformity.
Solution Approach 2:
The invention changes the thermal conductivity parameter by incorporating a thermal diffusion layer with higher thermal conductivity than the base dielectric material. This parameter change allows for improved heat distribution throughout the chuck without needing to increase the physical thickness of the base body, thereby achieving better temperature distribution while maintaining compact size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat uniformity across the electrostatic chuck, improving the temperature distribution and reducing variations, which is critical for effective semiconductor processing.
Implementation Method 1
a heating element that is built in the insulating layer and configured to generate heat
Implementation Method 2
at least one thermal diffusion layer that is built in the base body and configured to diffuse the heat generated by the heating element. The at least one thermal diffusion layer is formed of a material higher in thermal conductivity than the base body
Data Source
AI summary
An electrostatic chuck includes: a base body having: a mounting face on which an object to be adsorbed is to be mounted; and a back face that is opposite to the mounting face; an insulating layer that is formed on the back face; a heating element that is built in the insulating layer and configured to generate heat; and at least one thermal diffusion layer that is built in the base body and configured to diffuse the heat generated by the heating element. The at least one thermal diffusion layer is formed of a material higher in thermal conductivity than the base body.