Electrostatic Chuck Voltage Control for Substrate Chamber Cleaning
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Solution Overview
Problem
Substrate processing apparatuses face challenges in cleaning processing chambers without inducing abnormal electrical discharges, which can lead to reduced throughput and component damage.
Innovation Solution
A method involving a two-phase cleaning process with controlled voltage application and pressure management within the processing chamber, using a first and second processing step with distinct voltage settings to lift and scatter particles effectively while preventing abnormal electrical discharges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high voltage is applied to the stage in a low-pressure environment to lift off and scatter particles, then particle removal efficiency is improved, but abnormal electrical discharge may occur causing emergency stop or component damage
Solution Approach 1:
The patent applies parameter changes by adjusting the voltage applied to the stage based on the processing chamber's internal pressure. Specifically, the control unit modifies the voltage parameter according to pressure conditions to prevent abnormal electrical discharge while maintaining effective particle removal. This resolves the contradiction by dynamically optimizing the voltage parameter to achieve both high particle removal efficiency and system stability.
2Manufacturing precision
If high voltage is applied to the stage to eliminate particles effectively, then cleaning effectiveness is improved, but the risk of abnormal electrical discharge and component damage increases
Solution Approach 1:
The patent implements feedback control where the control unit continuously monitors the processing chamber's internal pressure and adjusts the voltage applied to the stage accordingly. This feedback mechanism ensures that the voltage remains within safe limits under low-pressure conditions to prevent abnormal electrical discharge, while still maintaining effective particle removal. The feedback loop resolves the contradiction by dynamically balancing cleaning effectiveness with safety.
3Productivity
If a two-stage cleaning process is executed with voltage application in low and high pressure environments, then particle elimination is improved, but process complexity increases
Solution Approach 1:
The patent applies universality by designing a control unit that can execute different voltage application strategies based on the current pressure condition. The same control unit and stage structure serve multiple functions: they handle both low-pressure and high-pressure cleaning phases with appropriate voltage adjustments. This multi-functionality approach reduces process complexity compared to having separate dedicated systems for each cleaning phase, while maintaining high particle elimination efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures optimal cleaning of substrate processing apparatuses by preventing abnormal electrical discharges, enhancing the efficiency of particle removal and reducing the risk of component damage.
Implementation Method 1
a cleaning method whereby the particles are lifted off and scattered and eliminated with maxwell stress generated by, for instance, applying a high voltage to the stage
Implementation Method 2
as the processing chamber is evacuated while supplying an inert gas into the processing chamber
Data Source
AI summary
The substrate processing apparatus includes a plurality of processing chambers. A given processing chamber is cleaned by first executing first processing during which voltage application control is executed to control a voltage applied to an electrostatic chuck based upon first processing voltage application information provided for the particular processing chamber while drawing an inert gas into the processing chamber and evacuating the processing chamber sustaining therein low pressure conditions therein and then executing second processing during which voltage application control is executed to control the voltage application to the electrostatic chuck based upon second processing voltage application information for the processing chamber while drawing in the inert gas and evacuating the processing chamber, the internal pressure of which is set to a high level. As a result, the inside of the processing chamber can be cleaned with voltage settings optimized for the structure adopted in the processing chamber.