Electrostatic Chuck Bonding Layout for Zoned Temperature Control
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Solution Overview
Problem
Existing substrate fixing devices face challenges in controlling temperature distribution on the adsorption surface, particularly in achieving different temperatures for the central and outer circumferential regions of the ceramic plate, due to uniform heat transfer from the carbon nanotube adhesive layer.
Innovation Solution
A substrate fixing device with a thermal conduction member arranged in either the central or outer circumferential region of the adhesive layer, featuring higher thermal conductivity in the stack direction than in the plane direction, allowing for localized heat transfer and improved temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an adhesive layer composed of carbon nanotube assembly is used to bond the ceramic plate to the base plate, then heat transfer property from the ceramic plate to the base plate is improved, but temperature distribution controllability on the adsorption surface deteriorates
Solution Approach 1:
The adhesive layer is divided into multiple regions with different thermal conductivities. Specifically, a first adhesive layer with higher thermal conductivity is placed in a central region, while a second adhesive layer with lower thermal conductivity is placed in an outer circumferential region. This segmentation allows independent thermal management of different areas, enabling precise temperature distribution control on the adsorption surface while maintaining overall heat transfer efficiency.
Solution Approach 2:
Different regions of the adhesive layer are assigned different thermal conductivity properties to meet local thermal requirements. The central region uses high thermal conductivity material for efficient heat dissipation, while the outer circumferential region uses low thermal conductivity material for heat insulation. This local quality differentiation resolves the contradiction between overall heat transfer improvement and localized temperature control.
2Reliability
If a carbon nanotube assembly adhesive layer is used, then thermal conductivity is improved, but uniform heat transfer across the entire ceramic plate occurs, limiting temperature distribution control
Solution Approach 1:
The adhesive layer is segmented into multiple regions with different thermal conductivities. A first adhesive layer with higher thermal conductivity is positioned in a central region, while a second adhesive layer with lower thermal conductivity is positioned in an outer circumferential region. This segmentation enables non-uniform heat transfer patterns, allowing precise control over temperature distribution across the ceramic plate surface.
Solution Approach 2:
Different regions of the adhesive layer are assigned different thermal conductivity properties to meet local thermal requirements. The central region uses high thermal conductivity material for efficient heat dissipation, while the outer circumferential region uses low thermal conductivity material for heat insulation. This local quality differentiation resolves the contradiction between overall heat transfer reliability and localized temperature control precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the controllability of temperature distribution on the adsorption surface by creating temperature differences between the central and outer regions, improving the precision of thermal management during microfabrication processes.
Implementation Method 1
a ceramic plate (120), which has an electrode (121) embedded therein, and adsorbs a substrate on an adsorption surface (120b) opposite to a lower surface (120a) by using electrostatic force
Implementation Method 2
a thermal conduction member (140), which is arranged in only a central region (R1), which overlaps a central portion of the ceramic plate (120) in a plan view, or in only an outer circumferential region (R2), which overlaps an outer circumferential portion of the ceramic plate (120) in a plan view, of at least one of an adhesive surface of the ceramic plate (120), an adhesive surface of the base plate (110), or an inside of the adhesive layer (130), and has thermal conductivity in a stack direction of the base plate (110) and the ceramic plate (120) higher than thermal conductivity in a plane direction perpendicular to the stack direction
Data Source
AI summary
A substrate fixing device includes a base plate, a ceramic plate bonded to the base plate via an adhesive layer and configured to adsorb a substrate by electrostatic force, a thermal conduction member arranged in only a central region, which overlaps a central portion of the ceramic plate in a plan view, or in only an outer circumferential region, which overlaps an outer circumferential portion of the ceramic plate in a plan view of at least one of an adhesive surface of the ceramic plate, an adhesive surface of the base plate, or an inside of the adhesive layer, the thermal conduction member having thermal conductivity in a stack direction of the base plate and the ceramic plate member higher than thermal conductivity in a plane direction perpendicular to the stack direction.