Electrostatic Chucking Device Adhesive Layer Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electrostatic chucking devices face challenges with adhesive layers that lack heat resistance at high temperatures, leading to stress, positional misalignment, and deterioration, which affects the fixation and temperature uniformity of ceramic substrates in semiconductor manufacturing.
Innovation Solution
The electrostatic chucking device employs a configuration with a first ceramic plate and a second ceramic plate adhered via a high heat-resistant first adhesive layer and a flexible second adhesive layer, which are designed to manage thermal expansion and heat transfer, ensuring the device operates effectively at temperatures above 200°C without deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a flexible adhesive layer is used to accommodate thermal expansion differences, then stress is reduced and fixation is improved, but heat resistance is insufficient causing melting or decomposition at high temperatures
Solution Approach 1:
The adhesive system is segmented into multiple layers: a lower adhesive layer (first adhesive layer) with high heat resistance positioned between the heating member and the electrostatic chuck, and an upper adhesive layer (second adhesive layer) with flexibility positioned between the electrostatic chuck and the cooling base portion. This segmentation allows each layer to perform its specialized function without compromising the other.
Solution Approach 2:
Different regions of the adhesive system are assigned different material properties according to local requirements: the lower adhesive layer near the heat source uses high-heat-resistance material to withstand thermal conditions, while the upper adhesive layer uses flexible material to accommodate thermal expansion differences. This local differentiation resolves the contradiction between heat resistance and flexibility.
2Reliability
If a high heat resistance adhesive layer is used to withstand high temperatures, then heat resistance is improved, but flexibility is reduced causing stress and positional misalignment
Solution Approach 1:
The adhesive system is segmented into multiple layers: a lower adhesive layer (first adhesive layer) with high heat resistance positioned between the heating member and the electrostatic chuck, and an upper adhesive layer (second adhesive layer) with flexibility positioned between the electrostatic chuck and the cooling base portion. This segmentation allows each layer to perform its specialized function without compromising the other.
Solution Approach 2:
Different regions of the adhesive system are assigned different material properties according to local requirements: the lower adhesive layer near the heat source uses high-heat-resistance material to withstand thermal conditions, while the upper adhesive layer uses flexible material to accommodate thermal expansion differences. This local differentiation resolves the contradiction between heat resistance and flexibility.
3Reliability
If the adhesive layer deteriorates at high temperatures, then heat resistance is insufficient, but this causes difference in thermal conduction coefficient and lowers temperature uniformity
Solution Approach 1:
The adhesive system is segmented into multiple layers: a lower adhesive layer (first adhesive layer) with high heat resistance positioned between the heating member and the electrostatic chuck, and an upper adhesive layer (second adhesive layer) with flexibility positioned between the electrostatic chuck and the cooling base portion. This segmentation allows each layer to perform its specialized function without compromising the other.
Solution Approach 2:
The first adhesive layer acts as an intermediary between the heating member and the electrostatic chuck, providing a stable thermal interface that prevents deterioration at high temperatures. This intermediary layer ensures consistent heat transfer to the sample while the second adhesive layer maintains flexibility to accommodate thermal expansion, thereby preserving temperature uniformity across the sample surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat resistance and maintains temperature uniformity, preventing positional misalignment and deterioration of the adhesive layers, allowing the device to operate reliably at high temperatures.
Implementation Method 1
a heating member 20 fixed to the second surface 10b
Implementation Method 2
a cooling base portion 60 adhered to the second ceramic plate 40
Implementation Method 3
a first adhesive layer 30 having a higher heat resistance than the second adhesive layer 50; a second adhesive layer 50 having a smaller Young's modulus than the first adhesive layer 30
Implementation Method 4
a base portion, a ceramic substrate and the adhesive layer causing the base portion and the ceramic substrate to be adhered to each other expand or contract due to heating
Data Source
AI summary
Provided is an electrostatic chucking device having high heat resistance. The electrostatic chucking device of the present invention includes a first ceramic plate which includes a first surface on which a substrate is able to be placed and a second surface on the opposite side thereof, and in which an internal electrode for electrostatic adsorption is embedded; a heating member fixed to the second surface; a second ceramic plate adhered to the first ceramic plate and the heating member via a first adhesive layer; and a cooling base portion adhered to the second ceramic plate via a second adhesive layer and cools at least the second ceramic plate. The first adhesive layer has a higher heat resistance than the second adhesive layer. The second adhesive layer has a smaller Young's modulus than the first adhesive layer.