Electrostatic Clamp Multi-Layer Film Lithography

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Solution Overview

Problem

Manufacturing electrostatic clamps using glass or glass ceramics with interposed electrodes is complex and expensive due to low yield and long lead times, making it difficult to achieve improved resolution in lithographic apparatuses for smaller feature sizes.

Innovation Solution

An electrostatic clamp comprising a multi-layer film with an electrically conducting layer between insulating layers, applied to a core member with projections and through holes, allowing the film to be positioned on the core's surface with projections extending through the holes, enabling effective substrate holding without the need for air pressure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If glass or glass ceramics with interposed electrodes are used for electrostatic clamps, then effective electrostatic clamping is achieved, but manufacturing complexity and cost increase due to difficult stack manufacturing with low yield and long lead times

Engineering Contradiction:
Improveelectrostatic clamping capabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The electrostatic clamp is divided into separate functional components: a core member with projections and a multi-layer film with through holes. This segmentation allows independent manufacturing of each component using standard processes, eliminating the need to manufacture complex stacked structures with interposed electrodes as a single integrated unit, thereby reducing manufacturing complexity and improving yield.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent replaces the traditional mechanical/electrical assembly approach (stacking glass or glass ceramic layers with electrodes) with a film-based system where a multi-layer film is applied to a core member. This substitution simplifies the manufacturing process by using depositable film layers that can be formed through standard semiconductor manufacturing techniques, reducing both complexity and lead time.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If glass or glass ceramics with interposed electrodes are used for electrostatic clamps, then effective electrostatic clamping is achieved, but production time increases due to long lead times

Engineering Contradiction:
Improveelectrostatic clamping capabilityVSAvoidproduction lead time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The core member with projections is prepared in advance, and the multi-layer film is designed to be applied through standard deposit processes. This preliminary preparation of components allows for parallel manufacturing and assembly, significantly reducing the overall production lead time compared to the sequential manufacturing required for stacked glass or glass ceramic structures with interposed electrodes.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If conventional vacuum-based substrate holders are used, then substrate clamping works in vacuum environments, but they cannot function with EUV radiation sources that require vacuum beam paths

Engineering Contradiction:
Improvesubstrate holding capabilityVSAvoidcompatibility with EUV radiation sources
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent changes the fundamental operating parameters of the substrate holder by using electrostatic forces generated through voltage applied to the multi-layer film rather than relying on vacuum pressure differentials. This parameter change allows the clamp to function effectively in vacuum environments required for EUV lithography while maintaining substrate holding capability, as the electrostatic force mechanism is independent of the vacuum condition.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution simplifies the manufacture of electrostatic clamps, reduces complexity and costs, and allows for the use of vacuum environments necessary for extreme ultraviolet lithography by providing a robust and efficient clamping mechanism for substrates in lithographic apparatuses.

Implementation Method 1

In one example of such an electrostatic chuck (or clamp) a potential difference is applied between an electrode on the substrate and an electrode in or on the substrate table. When the potential difference is applied, the electrode of the substrate and the electrode of the table become oppositely charged and attract each other with sufficient force to clamp the substrate in place.

Methodology Applied
Scientific EffectElectrostatic force: Electrostatics

Data Source

PatentUS9360771B2Electrostatic clamp, lithographic apparatus, and device manufacturing method
Publication Date: 2016.06.07 ASML NETHERLANDS BV
  • US9360771B2 patent drawing
  • US9360771B2 patent drawing
  • US9360771B2 patent drawing

AI summary

An electrostatic clamp for use in holding an object onto a supporting table, the electrostatic clamp comprising: a multi-layer film comprising an electrode defined in an electrically conducting layer which is positioned between electrically insulating layers.