Electrostatic Adhesive Cleaning for Curved Vacuum Chamber Surfaces
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Solution Overview
Problem
Existing cleaning methods for vacuum processing apparatuses fail to effectively remove particles from curved surfaces and fine roughness on insulating bodies coated on metal components, leading to contamination and defective semiconductor devices due to incomplete cleaning.
Innovation Solution
A cleaning apparatus with an adhesive sheet and a conductive sheet, applying positive or negative voltage and controlled pressing force, is used to closely adhere the adhesive sheet to the curved surface, allowing for effective removal of particles from the insulating body coated on the metal components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If ultrasonic waves or injected cleaning fluid are used to clean the insulating body coated on metal component, then cleaning is performed on the surface, but particles attached to the fine surface roughness cannot be removed since the cleaning medium does not reach the depth of the fine surface roughness
Solution Approach 1:
The patent replaces mechanical cleaning methods (ultrasonic waves, fluid injection) with an electrostatic field-based cleaning system. A conductive sheet is pressed against the insulating body surface, and voltage is applied to generate electrostatic attraction forces that draw particles out from the fine surface roughness, enabling effective cleaning of deep-seated particles without mechanical contact.
Solution Approach 2:
The patent changes the physical state and properties of the cleaning interface by applying voltage to the conductive sheet, creating an electrostatic field that fundamentally alters the interaction between the cleaning tool and particles. This parameter change (applying electrical field) enables the removal of particles from fine roughness that were inaccessible to conventional cleaning media.
2Manufacturing precision
If cleaning fluid or dry ice is injected to clean the insulating body, then surface cleaning is achieved, but particles in the fine roughness remain since the injected medium cannot penetrate deeply enough
Solution Approach 1:
The patent substitutes fluid-based cleaning mechanisms with an electrostatic field mechanism. Instead of relying on fluid penetration or dry ice particle penetration into the fine roughness, the system uses electrostatic attraction generated by applying voltage to a conductive sheet, which can act on particles regardless of their depth within the surface roughness structure.
3Productivity
If plasma processing is performed on components with insufficient cleaning, then production continues, but particles on curved surfaces and fine roughness attach to sample surfaces causing defective semiconductor devices
Solution Approach 1:
The patent performs preliminary electrostatic cleaning before plasma processing by pressing a voltage-applied conductive sheet against the insulating body surfaces (including curved surfaces and fine roughness areas). This preliminary action removes particles that would otherwise be transferred to samples during subsequent plasma processing, preventing device defects while maintaining production continuity.
Solution Approach 2:
The patent applies the electrostatic cleaning method specifically to areas with fine surface roughness and curved surfaces where particles are most problematic. The conductive sheet can be conformally applied to match the local geometry of different components, providing targeted cleaning quality where it is most needed to prevent semiconductor device defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures thorough cleaning of particles from both curved surfaces and fine roughness areas, preventing contamination and reducing defects in semiconductor devices by utilizing electrostatic attraction to remove particles efficiently.
Implementation Method 1
a conductive sheet having flexibility disposed on the opposite side from an adhesive surface of the adhesive sheet... applying positive or negative voltage to the conductive sheet... allowing for effective removal of particles from the insulating body coated on the metal components
Data Source
AI summary
The invention provides a cleaning apparatus for removing particles attached to the fine roughness on the surface of an insulating body coated on the metal surface of a vacuum processing apparatus. The present cleaning apparatus comprises an adhesive sheet 5 having a base material 51 and an adhesive surface 52, a conductive sheet 7 in contact with the base material 51, and a pressing member 11 for pressing the conductive sheet 7 onto the adhesive sheet 5, a voltage applying mechanism 9 for applying positive or negative voltage to the conductive sheet 7, and a pressing force controlling mechanism 8 for pressing the adhesive sheet 5 onto the curved surface 10 of the vacuum processing apparatus, wherein the pressing member 11 presses the conductive sheet 7 and the adhesive sheet 5 by a pressing force controlled via the pressing force controlling mechanism 8 in order to closely adhere the adhesive surface 52 of the adhesive sheet 5 to the curved surface of the insulating body 10 so as to remove particles attached to the insulating body 10, and positive or negative voltage is applied to the conductive sheet 7 to generate electrostatic attraction force so as to attract and remove particles attached to the insulating body 10.