Electrostatic Cleaning Device for Microdevice Transfer Contamination
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Solution Overview
Problem
Integration and packaging issues, particularly in micro devices such as RF MEMS microswitches and LED display systems, are hindered by traditional transfer technologies that require de-bonding of the transfer wafer and involve the entire wafer in the transfer process, leading to contamination and interference with subsequent operations.
Innovation Solution
An electrostatic cleaning device integrated into a mass transfer tool, featuring a cleaning electrode area with interdigitated electrode patterns and trace lines, allows for in-situ inspection and rapid cleaning of micro devices using electrostatic attractive forces, removing contamination without precise alignment and reducing tool downtime.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional transfer technologies are used, then the transfer process can be completed, but contamination occurs and tool downtime increases due to required de-bonding and cleaning operations
Solution Approach 1:
The patent applies preliminary action by performing cleaning operations during the transfer process itself rather than as a separate subsequent step. The electrostatic cleaning device is integrated into the transfer tool, allowing contamination to be removed immediately during tool operation, thereby eliminating dedicated cleaning downtime and maintaining continuous productivity.
2Productivity
If traditional transfer technologies are used, then devices can be transferred, but contamination is generated requiring separate cleaning operations
Solution Approach 1:
The patent merges the cleaning function with the transfer function by integrating an electrostatic cleaning device into the transfer tool. This combination allows both transfer and cleaning operations to be performed within the same tool system, eliminating the need for separate cleaning operations and reducing the harmful effect of contamination on subsequent manufacturing steps.
Solution Approach 2:
The patent converts the harmful effect of electrostatic contamination into a beneficial cleaning mechanism. By using electrostatic attraction, the cleaning device selectively attracts and removes contaminated particles from the device surface, transforming the problematic electrostatic forces that cause contamination into the very mechanism that removes it.
3Object-affected harmful factors
If electrostatic cleaning is applied, then contamination is removed effectively, but precise alignment is difficult to achieve
Solution Approach 1:
The patent applies dimensionality change by using the electrostatic field's natural property of acting over a distance rather than requiring direct contact. The cleaning electrode is positioned above the device surface at a controlled distance, creating an electrostatic field that spans the gap and attracts contaminants without requiring precise lateral alignment, thus solving the alignment precision problem.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electrostatic cleaning device effectively removes contamination from micro devices, enhancing transfer efficiency and reducing manufacturing costs by increasing tool availability and preserving mechanical integrity during the transfer process.
Implementation Method 1
allows for in-situ inspection and rapid cleaning of micro devices using electrostatic attractive forces
Data Source
AI summary
An electrostatic cleaning device, mass transfer tool, and method of operation are disclosed. In an embodiment an electrostatic cleaning device includes a cleaning electrode area including a first electrode pattern, a first trace line connected to the first electrode pattern, and a dielectric layer covering the cleaning electrode and the first trace line. In an embodiment, a mass transfer tool includes a translatable transfer head assembly that is translatable over a carrier substrate stage, a receiving substrate stage, and an electrostatic cleaning stage.