Electrostatic Dust Collector Assembly for Faster Low-Cost Production
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Solution Overview
Problem
Current electrostatic dust removal devices have complex production processes, leading to low production efficiency and increased costs.
Innovation Solution
A simplified production process for electrostatic dust removal devices involves sequentially placing dust collection plates and spacers to form a mold core, mounting fixed separators, and performing insulation treatment on the mold core.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional production processes are used for electrostatic dust removal devices, then production quality can be maintained, but production efficiency is low and input cost increases
Solution Approach 1:
The production process is divided into distinct modular steps: preparing dust collection plates with conductive and semiconductor layers, preparing spacers with insulation layers, sequentially stacking these components to form the mold core, mounting fixed separators, and performing insulation treatment. Each module can be independently prepared and assembled, streamlining the overall production process while maintaining quality standards.
Solution Approach 2:
The conductive layers and semiconductor layers are pre-printed and bonded to the dust collection plates before assembly. Similarly, insulation layers are pre-applied to spacers. This preliminary preparation eliminates complex on-site manufacturing steps during final assembly, significantly improving production efficiency while ensuring consistent quality.
2Reliability
If traditional production processes are used for electrostatic dust removal devices, then product quality can be ensured, but investment cost increases
Solution Approach 1:
The dust collection plates are equipped with self-adhesive conductive layers and semiconductor layers that bond automatically when pressed together. The spacers have self-adhesive insulation layers that similarly bond without requiring additional complex fastening mechanisms. This self-service bonding approach reduces manufacturing complexity and cost while ensuring reliable product quality.
3Manufacturing precision
If complex production processes are used, then device performance can be optimized, but production time increases
Solution Approach 1:
The conductive layer and semiconductor layer are combined in a single dust collection plate structure, with the semiconductor layer bonded directly to the conductive layer. The insulation layer on spacers is merged with the spacer structure itself. These merged structures eliminate the need for separate assembly steps, reducing production time while maintaining the precise layer configurations needed for device performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process improves production efficiency and reduces costs by stabilizing the mold core and simplifying the production steps, while maintaining the high purification efficiency and long service life of electrostatic dust removal devices.
Implementation Method 1
coating an adhesive layer after the conductive layer is dried, sticking or bonding the semiconductor layer on the adhesive layer
Implementation Method 2
performing insulation treatment on the end portion of the mold core through an insulation adhesive
Implementation Method 3
The electrostatic technology charges particulate matters in gas through ionization modules
Implementation Method 4
the charged particulate matters are adsorbed by the electric field formed by a dust collection module to complete purification
Data Source
AI summary
The present invention relates to a production process for an electrostatic dust removal device, and belongs to the technical field of air purification. The production process includes the following steps: S100: sequentially and alternately placing dust collection plates and spacers to form a mold core; S300: mounting fixed separators along fixed positions reserved on the dust collection plates, and dismantling the spacers; and S500: mounting an electric conductor at an end portion of the mold core, and performing insulation treatment on the end portion of the mold core through an insulation adhesive. According to the present invention, the technical problems of low production efficiency and increased input cost due to a tedious production process in the prior art can be solved.