Electrostatic Deposition of Conductive Patterns on Insulating Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for establishing conductive patterns on planar insulating substrates are inefficient, unsuitable for porous or web-form substrates, and face challenges with solvent evaporation, oxidation, and low conductivity, particularly when using liquid-phase materials and deposition masks.
Innovation Solution
An apparatus and method that utilize conductive particles deposited and sintered onto a planar insulating substrate using a coupling agent and electro-magnetic fields to create a predefined pattern, allowing for high-resolution, efficient, and flexible conductive plane formation without the need for intermediate drying stages or high temperatures, suitable for various substrates including paper and plastics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional methods such as electroplating and screen printing are used, then conductive patterns can be established on substrates, but the process is slow and not suitable for porous substrates or web-form substrates
Solution Approach 1:
The patent replaces traditional mechanical printing methods (screen printing, flexo printing, rotogravure printing) with an electrostatic deposition system. The system uses electrostatic fields to transfer conductive particles from a donor drum to the substrate, enabling high-speed processing while being compatible with porous and web-form substrates. This substitution of mechanical deposition with electrostatic deposition resolves the contradiction between production speed and substrate compatibility.
2Ease of manufacture
If liquid-phase materials are used for printing conductive patterns, then the patterns can be formed, but solvent evaporation and absorption of components in porous structures occur
Solution Approach 1:
The patent changes the physical state of the conductive material from liquid-phase (requiring solvent) to dry powder form. The electrostatic deposition process transfers dry conductive particles directly onto the substrate without requiring liquid carriers or solvents. This parameter change eliminates solvent evaporation issues and prevents absorption of components in porous structures, while still enabling conductive pattern formation.
3Ease of manufacture
If conductive polymers are used, then conductive patterns can be printed, but insufficient electric conductivity and protection against oxidation are achieved
Solution Approach 1:
The patent uses composite conductive particles that combine metal particles (providing high conductivity and oxidation resistance) with polymer particles (providing printability and adhesion). The metal particles contribute excellent electrical conductivity and resistance to oxidation, while the polymer component enables the material to be deposited using electrostatic printing methods. This composite approach resolves the contradiction between ease of manufacture and reliability of the conductive pattern.
4Manufacturing precision
If deposition masks are used to create patterns, then conductive patterns can be formed, but the process becomes complex and resolution is limited
Solution Approach 1:
The patent extracts and eliminates the deposition mask component from the traditional printing process. Instead of using physical masks to define patterns, the system uses electrostatic fields generated by a charged drum surface to selectively deposit conductive particles only in desired pattern areas. This extraction of the mask eliminates process complexity while achieving high-resolution patterns through electrostatic field control.
5Reliability
If high temperatures are used for sintering conductive particles, then continuous conducting patterns are formed, but substrate weakening occurs
Solution Approach 1:
The patent changes the sintering temperature parameter from high temperature to low temperature processing. The system uses a combination of electrostatic deposition and low-temperature sintering (or alternative bonding mechanisms) to form continuous conducting patterns without exposing the substrate to high temperatures that would cause weakening. This parameter change enables both pattern continuity and substrate strength to be maintained.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the accurate and efficient establishment of conductive patterns on a wide range of substrates with improved conductivity and flexibility, avoiding the limitations of traditional methods such as solvent removal and substrate weakening, while maintaining high resolution and customizability.
Implementation Method 1
utilize conductive particles deposited and sintered onto a planar insulating substrate using a coupling agent and electro-magnetic fields to create a predefined pattern
Implementation Method 2
at least partially sintered at elevated temperature and pressure in order to convert the particle-formed pattern into a continuously conducting pattern
Data Source
Figure 1
Figure 2a~3
Figure 4a~4d
AI summary
An apparatus, a method, a planar insulating substrate and a chipset have been presented, comprising at least one module configured to establish a predefined pattern on a planar insulating substrate so that conductive particles can gather according to the predefined pattern. At least one another module is configured to transfer the conductive particles to the planar insulating substrate, wherein the conductive particles are arranged to gather according to the predefined pattern. A sintering module is configured to fuse the conductive particles on the planar insulating substrate, wherein the conductive particles are arranged to fuse according to the predefined pattern to establish a conductive plane on the planar insulating substrate. Embodiment of the invention relate to printable or printing electronics on a fibrous web.