Electrostatic Edge Ring Clamping for Temperature and Seal Control
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Solution Overview
Problem
Current plasma processing technologies face challenges in effectively regulating the temperature of edge rings in plasma processing chambers, leading to potential sealing failures and inefficient process control.
Innovation Solution
The method involves using an electrostatically clamped edge ring with backside temperature channels that provide a gas flow to regulate temperature, where a vacuum is applied to measure pressure, and an electrostatic ring clamping voltage is applied when pressure reaches a threshold, allowing for continuous temperature control and seal integrity monitoring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional O-ring configurations are used for sealing the edge ring, then sealing functionality is provided, but installation complexity and technician difficulty increase
Solution Approach 1:
The patent replaces the mechanical O-ring sealing system with an electrostatic sealing system. The edge ring incorporates an electrostatic chuck that uses electrostatic forces to seal against the substrate, eliminating the need for mechanical O-rings. This substitution maintains sealing integrity while significantly simplifying installation and improving ease of operation.
2Temperature
If temperature regulation channels are added to the edge ring, then temperature control is improved, but device complexity increases
Solution Approach 1:
The electrostatic chuck in the edge ring serves multiple functions simultaneously: it provides sealing against the substrate, regulates temperature through integrated cooling channels, and maintains positional stability. By combining these functions into a single multi-functional component, the patent achieves improved temperature control without proportionally increasing device complexity.
Solution Approach 2:
The patent merges the sealing function, temperature regulation function, and electrostatic clamping function into a single integrated edge ring structure. The cooling channels are embedded within the electrostatic chuck body, combining thermal management with sealing and clamping operations, thereby achieving temperature control without excessive structural complexity.
3Reliability
If vacuum pressure monitoring is implemented, then sealing failure detection is improved, but measurement and control complexity increases
Solution Approach 1:
The patent implements a feedback system where pressure sensors continuously monitor the vacuum pressure within the edge ring's sealing chamber. This real-time pressure data is fed back to the control system, which automatically detects sealing failures by monitoring for pressure changes that indicate loss of vacuum integrity. The feedback mechanism enables reliable sealing failure detection through straightforward pressure monitoring without excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures reliable temperature regulation of the edge ring, prevents sealing failures, and improves overall plasma processing control, offering advantages over traditional O-ring configurations by simplifying the installation process and enhancing technician usability.
Implementation Method 1
an electrostatic ring clamp with at least one ring backside temperature channel for providing a flow of gas to the edge ring to regulate the temperature
Implementation Method 2
at least one ring backside temperature channel for providing a flow of gas to the edge ring to regulate the temperature
Implementation Method 3
Pressure in the at least one ring backside temperature channel is measured. An electrostatic ring clamping voltage is provided when the pressure in the at least one ring backside temperature channel reaches a threshold maximum pressure
Data Source
AI summary
A method for electrostatically clamping an edge ring in a plasma processing chamber with an electrostatic ring clamp with at least one ring backside temperature channel for providing a flow of gas to the edge ring is provided. A vacuum is provided to the at least one ring backside temperature channel Pressure in the backside temperature channel is measured. An electrostatic ring clamping voltage is provided when the pressure in the backside temperature channel reaches a threshold maximum pressure. The vacuum to the backside temperature channel is discontinued. Pressure in the backside temperature channel is measured. If pressure in the backside temperature channel rises faster than a threshold rate, then sealing failure is indicated. If pressure in the backside temperature channel does not rise faster than the threshold rate, a plasma process is continued, using the backside temperature channel to regulate a temperature of the edge ring.