Electrostatic Edge Ring Mounting for Thermal Uniformity and Fast Swap
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Solution Overview
Problem
Existing substrate processing systems face challenges in achieving accurate edge tilt uniformity and thermal management, particularly for newer technology nodes, due to cumbersome replacement of thermal interface material (TIM) during chamber cleaning, leading to prolonged chamber downtime and reduced customer satisfaction.
Innovation Solution
An edge ring system with electrostatic clamping and gas supply lines for thermal management, allowing quick replacement and improved thermal conductance, combined with seals for vacuum integrity, reduces the need for TIM and enhances RF coupling control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal interface material (TIM) is used to improve thermal performance and edge ring temperature control, then thermal management is enhanced, but the TIM needs to be replaced every time the processing chamber is cleaned, causing long chamber open-to-close periods and reducing productivity
Solution Approach 1:
The patent extracts the thermal interface function from a replaceable TIM layer and integrates it into the edge ring support structure itself. The support structure includes thermal management features directly built-in, eliminating the need for separate TIM that would require replacement during chamber cleaning cycles.
Solution Approach 2:
The edge ring support structure is designed to perform multiple functions simultaneously: mechanical support for the edge ring, thermal management through integrated cooling channels or thermal pathways, and structural attachment to the baseplate. This multi-functionality eliminates the need for separate TIM components.
2Reliability
If TIM is replaced during chamber cleaning, then thermal performance is maintained, but chamber downtime increases and customer satisfaction decreases
Solution Approach 1:
The thermal management capability is built into the edge ring support structure from the beginning, with integrated cooling channels or thermal pathways. This preliminary integration ensures thermal performance is maintained without requiring subsequent TIM replacement actions during chamber cleaning cycles.
3Stability of the object's composition
If edge ring is bonded to edge ring support, then structural stability is improved, but replacement and maintenance become difficult
Solution Approach 1:
The patent employs a dynamic attachment system where the edge ring can be securely held during operation but easily released when needed. The electrostatic clamping mechanism allows the edge ring to be firmly attached to the support structure during processing, then quickly removed by adjusting the clamping force, enabling easy replacement without permanent bonding.
4Ease of operation
If electrostatic clamping is used to hold edge ring, then quick replacement is enabled, but RF voltage coupling impedance control becomes more complex
Solution Approach 1:
The patent introduces an intermediary mechanism between the electrostatic clamping system and the RF voltage coupling control. This intermediary layer manages the interaction between the clamping electrode and the edge ring, providing a controlled interface that simplifies RF impedance management while maintaining the benefits of electrostatic clamping for easy replacement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system ensures precise edge tilt uniformity and thermal control, reduces chamber downtime, and increases customer satisfaction by simplifying the replacement process, while minimizing arcing and improving RF impedance control.
Implementation Method 1
an electrostatic clamping electrode arranged in the first body... An edge ring includes a second body arranged on and electrostatically clamped to the edge ring support
Implementation Method 2
A gas supply line is configured to supply gas between the edge ring and the edge ring support... improved thermal conductance
Implementation Method 3
A supply conductor is configured to supply power to the electrostatic clamping electrode
Implementation Method 4
combined with seals for vacuum integrity
Data Source
AI summary
An edge ring system comprising a substrate support configured to support a substrate during plasma processing and including a baseplate and an upper layer arranged on the baseplate. An edge ring support includes a first body and an electrostatic clamping electrode arranged in the first body. The edge ring support is arranged above the baseplate and radially outside of the substrate during processing. An edge ring includes a second body arranged on and electrostatically clamped to the edge ring support during plasma processing.