Electrostatic Edge Ring Transfer Unit for Semiconductor Processing
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Solution Overview
Problem
In semiconductor device manufacturing, the edge ring in substrate processing apparatuses is frequently replaced due to exposure to chemical and physical etching, leading to issues with particle generation and control failures in existing manual or actuator-based replacement methods.
Innovation Solution
A transfer unit with electrostatic fixing members, including first and second electrodes of different polarities, is used to efficiently transfer and replace edge rings of varying sizes by applying voltages to fix and detach the rings from the processing unit using electrostatic forces, reducing the need for manual intervention and minimizing particle generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual replacement or actuator-based replacement is used, then the edge ring can be replaced, but particle generation increases and control failures occur
Solution Approach 1:
The patent replaces manual mechanical operations and actuator-based mechanical systems with an electrostatic field-based system. The transfer unit uses electrostatic attraction between charged electrodes and the edge ring to achieve automated, precise, and clean replacement without mechanical contact, thereby eliminating particle generation from mechanical operations and improving control reliability.
Solution Approach 2:
The patent introduces an electrostatic field as an intermediary between the transfer unit and the edge ring. This electrostatic field serves as a clean, contactless mediator that enables precise control of the edge ring during replacement, avoiding direct mechanical contact that would generate particles and improve operational reliability.
2Ease of operation
If manual replacement is used, then the edge ring can be replaced, but the number of driving parts increases leading to control failures
Solution Approach 1:
The patent replaces complex mechanical driving systems with a simplified electrostatic field-based system. Instead of using multiple actuators, motors, and mechanical linkages, the system uses electrostatic attraction and repulsion forces controlled by voltage application, dramatically reducing the number of driving parts while improving ease of operation and control reliability.
Solution Approach 2:
The edge ring itself becomes part of the control system through its interaction with the electrostatic field. The charged edge ring responds directly to voltage changes on the electrodes, enabling simple, intuitive control without complex mechanical transmission systems, thereby reducing device complexity while maintaining ease of operation.
3Manufacturing precision
If frequent replacement is performed, then the substrate processing quality is maintained, but productivity decreases due to maintenance needs
Solution Approach 1:
The patent replaces mechanical replacement systems with an electrostatic field-based system that enables faster, cleaner, and more reliable edge ring replacement. This reduces the time and complexity associated with frequent replacements, maintaining substrate processing quality while minimizing productivity loss during maintenance operations.
Solution Approach 2:
The electrostatic field serves as a clean, contactless intermediary that enables rapid and precise edge ring replacement without mechanical contact. This reduces replacement time and eliminates particle contamination risks, allowing frequent replacements to be performed quickly and cleanly, thereby maintaining manufacturing precision while improving overall productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient and controlled replacement of edge rings, reducing particle generation and improving the reliability of the substrate processing apparatus by using electrostatic forces to securely transfer and replace rings of different sizes, thereby enhancing the processing efficiency and reducing maintenance needs.
Implementation Method 1
a fixing member that is provided in the hand and that fixes the edge ring to a bottom side of the hand with an electrostatic force
Implementation Method 2
the transfer unit may further include a voltage applying device that applies voltages of different polarities to the first electrode and the second electrode
Data Source
AI summary
The substrate processing apparatus includes a processing unit and a transfer unit that transfers a substrate into the processing unit. The processing unit includes a support unit that supports the substrate in the process chamber. The support unit includes a support on which the substrate is placed and an edge ring that surrounds the substrate placed on the support and that is detachable from the support. The transfer unit includes a hand having a top side on which the substrate is placed and a fixing member that is provided in the hand and that fixes the edge ring to a bottom side of the hand with an electrostatic force. The fixing member includes a first electrode and second electrode, and the transfer unit further includes a voltage applying device that applies voltages of different polarities to the first electrode and the second electrode.