Electrostatic End Effector for Substrate Transfer
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Solution Overview
Problem
Conventional mechanical end effectors often damage or contaminate thin substrates during transfer due to high mechanical clamping forces, especially when handling fragile substrates with thicknesses of 100 μm or less, and require significant physical contact, which is undesirable for processes like substrate flipping and cleaning.
Innovation Solution
An end effector equipped with an electrostatic chucking force generating assembly, comprising interleaving electrode fingers and an encapsulating member, which applies an electrostatic force to securely hold substrates with minimal contact, reducing the risk of damage and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional mechanical end effector is used to clamp substrate, then substrate can be securely held, but substrate may be damaged or contaminated due to high mechanical clamping force
Solution Approach 1:
The patent replaces the conventional mechanical clamping system with an electrostatic chucking system. The electrostatic end effector generates electrostatic attraction force between the chucking surface and substrate to hold the substrate securely during transfer, eliminating the need for high mechanical clamping forces that cause damage and contamination.
Solution Approach 2:
The patent changes the fundamental parameter of holding force from mechanical contact force to electrostatic field force. By applying voltage to generate electrostatic attraction, the system achieves secure substrate holding with minimal physical contact, thereby preventing mechanical damage and contamination while maintaining reliable substrate fixation.
2Reliability
If mechanical end effector applies sufficient clamping force, then substrate can be securely transferred, but physical contact increases leading to contamination
Solution Approach 1:
The patent substitutes mechanical contact-based holding with electrostatic field-based holding. The electrostatic end effector creates an electric field that attracts and holds the substrate without requiring significant physical contact, thus achieving secure transfer while minimizing contamination from mechanical contact.
3Object-affected harmful factors
If electrostatic chucking force is used to hold substrate, then substrate damage and contamination are reduced, but device complexity increases
Solution Approach 1:
While the electrostatic end effector introduces electrical components, the overall device complexity is managed by integrating the electrostatic chucking mechanism into a compact structure. The replacement of complex mechanical clamping systems with electrostatic fields actually simplifies the mechanical structure, reducing moving parts and mechanical linkages while achieving the same or better holding performance with less physical contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electrostatic chucking force allows for secure transfer of thin substrates without mechanical damage or contamination, enabling efficient handling of fragile substrates with minimal contact, thus enhancing the reliability and cleanliness of substrate processing.
Implementation Method 1
generating an electrostatic chucking force from the end effector to chuck the substrate on the end effector
Data Source
AI summary
Embodiments of the present invention provide an end effector capable of generating an electrostatic chucking force to chuck a substrate disposed therein without damaging the substrate. In one embodiment, an end effector for a robot, the end effector includes a body having an electrostatic chucking force generating assembly, and a mounting end coupled to the body, the mounting end for coupling the body to the robot.