Electrostatic Induction Film Thickness Detection Device
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Solution Overview
Problem
Conventional film thickness detection devices have low accuracy and are not suitable for high-speed, multipoint, multi-channel measurements, and they generate noise, which is not environmentally friendly.
Innovation Solution
A film thickness detection device comprising a common unit with a common electrode and a detection unit with sensor chips and a signal processing unit, where the sensor chips have multiple detection electrodes arranged perpendicular to the film's moving direction, allowing for adjustable detection accuracy and reduced noise through signal processing circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional thickness detection technologies (Hall component, ultrasonic detection, electromagnetic induction) are used, then the detection device can measure film thickness, but the device volume is large and cost is high
Solution Approach 1:
The patent replaces conventional mechanical and electromagnetic detection systems with an electrostatic induction-based detection system. By using electrostatic induction between electrodes to detect film thickness, the device achieves accurate measurements while significantly reducing device volume and cost compared to Hall components, ultrasonic detectors, or electromagnetic induction systems.
Solution Approach 2:
The patent changes the detection parameter from mechanical/electromagnetic fields to electrostatic induction fields. By measuring the electrostatic induction signal between electrodes that varies with film thickness, the system achieves compact design while maintaining measurement capability, directly addressing the volume-reduction requirement.
2Volume of stationary object
If mechanical devices are used to generate displacement of capacitive plate for thickness detection, then the device size is reduced, but measurement accuracy decreases and mechanical noise is generated during high-speed operation
Solution Approach 1:
The patent eliminates mechanical displacement-generation devices entirely by using electrostatic induction between fixed electrodes. The film thickness is detected through changes in electrostatic induction signals caused by the film's position between electrodes, not through mechanical plate displacement. This substitution removes mechanical noise sources and improves measurement accuracy during high-speed operation while maintaining compact device size.
Solution Approach 2:
The patent extracts and removes the mechanical displacement-generation component from the detection system. By using fixed electrodes that detect thickness through electrostatic induction signal variations, the system eliminates the mechanical device that would generate noise and limit accuracy, while preserving the reduced device size advantage.
3Volume of stationary object
If conventional capacitive thickness sensors are used, then device size is reduced, but detection accuracy is relatively low particularly for thin objects under high-speed transmission
Solution Approach 1:
The patent replaces conventional capacitive sensing with electrostatic induction-based detection. By measuring the electrostatic induction signal between electrodes that is directly influenced by the thin film's position and thickness, the system achieves superior detection accuracy for thin objects during high-speed transmission while maintaining compact device dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves higher detection accuracy and flexibility in measurement by adjusting the number of detection electrodes or sensor chips, while minimizing noise and environmental impact.
Implementation Method 1
the each sensor chip is configured to sense a electrical signal on the common electrode and output the sensed electrical signal
Data Source
AI summary
Disclosed is a film thickness detection device, including a common unit (1) and a detection unit (2); the common unit (1) comprises at least one common electrode (11); the detection unit (2) comprises at least one sensor chip (21) and a signal processing unit (23); the sensor chips (21) are opposite to the common unit (1) in a first direction and are arranged at intervals; the spaces between the common unit (1) and the sensor chips (21) form a transport channel for a to-be-tested film; each of the sensor chips (21) comprises at least one row of multiple detection electrodes (211) arranged along a second direction; the second direction is perpendicular to a moving direction of the to-be-tested film; the first direction is perpendicular to a first plane; the first plane is parallel to the second direction; the sensor chips (21) are configured to induce electrical signals on the common electrodes (11) and output the electrical signals; and the signal processing unit (23) is electrically connected with the sensor chips (21), processes the electrical signals output by the sensor chips (21) and outputs the electrical signals.