Electrostatic Light Board Assembly for Micro-LED Mass Transfer
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Solution Overview
Problem
The existing Micro-LED display assembly process faces challenges in accuracy and efficiency due to the need for precise arrangement and transfer of multiple RGB Micro-LED chips, which increases the complexity and requirements of the mass transfer process.
Innovation Solution
A light board assembly method that includes a bottom plate with partition sections, a main capacitor plate, and an electrostatic coating on the light-emitting chips, allowing for direct placement of chips without initial orientation adjustment. The assembling structure drives the main capacitor plate to move, aligning and attaching the light-emitting chips with reduced accuracy requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple RGB Micro-LED chips are arranged in sequence on a substrate, then full-color display capability is achieved, but the mass transfer process becomes complex and less efficient
Solution Approach 1:
The invention segments the mass transfer process into two independent stages: first transferring all red chips, then all green chips, and finally all blue chips to their respective substrates. This segmentation simplifies each transfer operation by eliminating the need for sequential RGB chip arrangement, thereby improving mass transfer efficiency while maintaining full-color display capability through subsequent chip grouping.
2Adaptability or versatility
If three RGB chips are evenly spaced in a horizontal plane to realize RGB effect, then full-color display is achieved, but the number of chips transferred increases and requires higher accuracy
Solution Approach 1:
The invention performs preliminary action by pre-grouping the transferred chips into red, green, and blue clusters on the substrate after mass transfer. This preliminary grouping allows the use of less precise mass transfer equipment while still achieving the required RGB display effect, as the final chip arrangement is completed in a subsequent assembly step rather than during the high-speed transfer process.
3Manufacturing precision
If high precision mass transfer process is used to arrange RGB chips accurately, then chip arrangement accuracy is improved, but the complexity and requirements of the transfer process increase
Solution Approach 1:
The invention extracts the chip arrangement function from the mass transfer process. Instead of requiring the transfer equipment to precisely place each RGB chip in its final position, the process only needs to transfer chips to temporary locations on the substrate. The precise arrangement is then achieved in a separate assembly step, simplifying the transfer process while maintaining final arrangement accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the accuracy needed for transferring large quantities of light-emitting chips, simplifies the Micro-LED mass transfer process, and improves the production yield and assembly efficiency of Micro-LED displays.
Implementation Method 1
When the main capacitor plate is energized, the light-emitting chip moves toward the main capacitor plate under the action of the first electrostatic coating
Data Source
AI summary
A light board, a display device, and a method of assembling the light board are disclosed. The light board includes a bottom plate, a main capacitor plate, an assembling structure, and multiple light-emitting chips. There are disposed multiple partition plates on the bottom plate, and the multiple partition plates divide the bottom plate into multiple sections. Multiple light-emitting chips are respectively arranged in the multiple sections. A first electrostatic coating is disposed on a top surface of each light-emitting chip. The main capacitor plate is arranged opposite to the bottom plate, and the light-emitting chips are disposed between the bottom plate and the main capacitor plate. The assembling structure is disposed on the bottom plate, and is connected to the main capacitor plate. The assembling structure is operative to drive the main capacitor plate to reciprocate in a direction toward or away from the bottom plate.