Electrostatic Mask Spacing for OLED Deposition Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In small mask scanning (SMS) deposition processes for large substrates, micro-vibration in the metal mask leads to variations in deposition position and thickness of the deposition material, affecting the uniformity of the thin films formed on OLED displays.
Innovation Solution
A deposition apparatus and method that includes a substrate fixing part, mask transfer parts, a mask spacing part, and a deposition source, where the mask is pre-located at a predetermined distance from the substrate using electrostatic and magnetic forces to minimize vibration and maintain uniform distance, ensuring consistent deposition thickness and position.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a metal mask is fixed on a source and the substrate is scanned at a predetermined distance during SMS deposition, then deposition can be performed on large substrates, but micro-vibration of the metal mask causes variation in deposition position and thickness
Solution Approach 1:
The patent replaces the mechanical contact-based mask positioning system with an electrostatic field-based positioning system. The mask spacing part generates an electrostatic field that levitates and positions the metal mask at a predetermined distance from the substrate without mechanical contact, thereby eliminating micro-vibrations caused by mechanical instability while maintaining the SMS deposition capability for large substrates
Solution Approach 2:
The patent introduces an electrostatic field as an intermediary between the metal mask and the substrate. The mask spacing part creates this electrostatic field to maintain a stable, vibration-free distance between the mask and substrate during the scanning process, resolving the contradiction between maintaining deposition capability and achieving uniformity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively minimizes variations in deposition position and thickness, resulting in more uniform thin film formation on large substrates during the SMS deposition process.
Implementation Method 1
a substrate fixing part for fixing a deposition substrate on which a deposition material is deposited to the lower part thereof
Implementation Method 2
a mask spacing part positioned on the substrate fixing part and maintaining a uniform distance between the deposition substrate and the deposition mask when the deposition substrate is moved
Data Source
AI summary
A deposition apparatus for manufacturing a display device is disclosed. In one aspect, the apparatus includes a substrate fixing portion configured to fix a deposition substrate to a lower portion thereof and a first mask transfer portion placed on one side of the substrate fixing portion and configured to move the deposition mask upwardly such that the deposition mask is formed spaced apart from the deposition substrate by a predetermined distance. The apparatus also includes a substrate transfer portion configured to move the deposition substrate such that the deposition substrate passes over the deposition mask. The apparatus further includes a mask spacing portion positioned on the substrate fixing portion and configured to maintain a substantially uniform distance between the deposition substrate and the deposition mask when the deposition substrate is moved and a deposition source configured to deposit a deposition material on the deposition substrate through the deposition mask.