Electrostatic Microthruster for Semiconductor Cooling
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Solution Overview
Problem
Existing semiconductor devices require large, power-intensive mechanical devices to move fluids, which are unsuitable for low-power and small-form-factor applications.
Innovation Solution
A microplasma generation mechanism using electrodes on a semiconductor device package to create and manipulate a microplasma, allowing for the movement of fluid without mechanical devices by generating an electric field that moves ionized and non-ionized molecules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional mechanical devices (fans) are used to move fluid, then fluid movement capability is achieved, but device size and power consumption increase significantly
Solution Approach 1:
The patent replaces traditional mechanical fans with an electrostatic microthruster that uses electrostatic forces to move fluid. The device comprises a substrate with a first electrode and a second electrode, where voltage applied to the electrodes creates electrostatic forces that propel fluid without any moving mechanical parts, thereby eliminating the need for mechanical motors and significantly reducing power consumption.
Solution Approach 2:
The invention extracts and eliminates the mechanical components (motors, blades, moving parts) from the fluid movement system. By using only static electrodes and electrostatic fields, the patent removes the power-intensive mechanical subsystem while retaining fluid movement functionality through a fundamentally different physical mechanism.
2Productivity
If traditional mechanical devices (fans) are used to move fluid, then fluid movement capability is achieved, but device size increases
Solution Approach 1:
The patent replaces bulky mechanical fans with a planar electrostatic microthruster consisting of electrodes deposited on a substrate. This substitution enables fluid movement in a thin, flat device structure with no protruding mechanical components, dramatically reducing the device footprint while maintaining fluid movement functionality.
Solution Approach 2:
The invention transitions from three-dimensional mechanical structures (fans with rotating blades) to a two-dimensional planar electrode configuration. The electrostatic microthruster operates in a planar geometry where voltage applied to patterned electrodes on the substrate surface creates fluid flow without requiring vertical space for mechanical rotation, thus minimizing device footprint.
3Productivity
If voltage is applied to generate electrostatic force, then fluid movement is achieved, but charge accumulation may occur on insulated surfaces
Solution Approach 1:
The patent introduces a conductive layer as an intermediary between the electrode and the insulated surface. This conductive intermediate layer serves as a charge reservoir that prevents charge accumulation on the insulated surface by providing a path for charge dissipation, while still allowing the electrostatic field to function effectively for fluid movement.
Solution Approach 2:
The invention converts the potentially harmful effect of charge accumulation into a beneficial feature by using a conductive layer to manage charge distribution. The charge that would otherwise accumulate harmfully on insulated surfaces is instead directed to the conductive layer, where it can be safely dissipated or redistributed, preventing electrostatic discharge issues while maintaining thrust generation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient fluid movement and cooling of semiconductor devices using low power, with the microplasma generator capable of producing forces sufficient to accelerate ambient air and potentially move masses, while maintaining a compact form factor.
Implementation Method 1
a first electrode and a second electrode are formed on the substrate. The first and second electrodes are configured to generate an electrostatic force that moves the plasma and that moves the surrounding fluid in response to a voltage applied to the first and second electrodes.
Implementation Method 2
One of the first and second electrodes is configured to be a field emitting electrode when a voltage is applied
Implementation Method 3
A distance between edges of the first electrode and the second electrode is such that a plasma can be formed in an ambient gas at a predetermined voltage difference between the first electrode and the second electrode
Data Source
AI summary
Embodiments of the present invention provide for movement of a fluid around a small form-factor device, such as a semiconductor device die or package, through use of a microplasma. Embodiments provide for a microplasma generated in an ambient fluid with a lower power than predicted by a Paschen Curve for that fluid. The ionized molecules of the plasma can be manipulated by further generation of an electric field that can be used, for example, to move the ions in a desired direction. The movement of the ionized fluid generates a fluid flow of neighboring, non-ionized fluid molecules in the desired direction.