Electrostatic Puck Trench Electrode Layout for Uniform Chucking
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Solution Overview
Problem
Electrostatic chucks with embedded electrodes in semiconductor processing face issues such as thickness non-uniformities, cracks, and altered ceramic properties during the sintering process, affecting the electrostatic force and thermal profile.
Innovation Solution
A method involving forming trenches in a ceramic substrate, depositing and planarizing electrode material within these trenches, and securing an upper substrate without hot pressing, using techniques like chemical-mechanical planarization and thermal spraying to create a flat, coplanar electrode for improved electrostatic chucking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If screen printing method is used to form electrode, then manufacturing process is simple, but electrode thickness uniformity deteriorates
Solution Approach 1:
The patent replaces the mechanical screen printing process with a deposition process that forms the electrode layer conformally within the trench structure. This substitution eliminates the thickness non-uniformity inherent in screen printing while maintaining manufacturing feasibility through controlled deposition methods.
Solution Approach 2:
The patent performs preliminary formation of trenches with precise depth and width control before depositing the electrode material. This preliminary structuring ensures that the subsequent electrode formation achieves uniform thickness, as the trench geometry pre-determines the final electrode dimensions.
2Ease of manufacture
If sintering process is used to form ceramic structure, then ceramic parts are formed, but cracks and pores are generated
Solution Approach 1:
The patent applies local quality by creating a trench structure that confines the electrode material to a specific region. This localized configuration allows the ceramic substrate to be sintered without generating cracks and pores in the electrode region, as the trench structure provides structural support and prevents defect formation during the sintering process.
3Ease of manufacture
If sintering process is used to form ceramic structure, then ceramic parts are formed, but ceramic properties are altered
Solution Approach 1:
The patent uses local quality by creating a trench structure that protects the electrode material and maintains ceramic property stability during sintering. The trench configuration ensures that the ceramic substrate undergoes uniform sintering without altering its fundamental properties, while the electrode material within the trench remains unaffected by thermal degradation.
4Ease of manufacture
If electrode thickness is non-uniform, then manufacturing is easier, but electrostatic force uniformity deteriorates
Solution Approach 1:
The patent performs preliminary formation of trenches with precisely controlled geometry before electrode deposition. This preliminary structuring ensures that the electrode material deposits uniformly within the trench, achieving both ease of manufacture and uniform electrostatic force, as the trench walls guide the deposition process.
Solution Approach 2:
The patent replaces the screen printing mechanism with a deposition process that conforms to the trench geometry. This substitution ensures uniform electrode thickness by allowing the deposition process to naturally follow the trench walls, eliminating the thickness variations inherent in screen printing.
5Ease of manufacture
If second layer thickness is non-uniform, then manufacturing is simpler, but electrostatic chucking ability deteriorates
Solution Approach 1:
The patent performs preliminary formation of trenches with controlled depth and width before depositing the second layer of green ceramic material. This preliminary structuring ensures uniform thickness of the second layer, as the trench walls provide a defined boundary that guides the deposition process, thereby maintaining electrostatic chucking ability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a more uniform electrostatic force and improved thermal profile by ensuring a flat, coplanar electrode with reduced thickness variations, enhancing the electrostatic chuck's ability to secure semiconductor wafers.
Implementation Method 1
depositing an electrode material onto the lower substrate and into the at least one trench
Implementation Method 2
the excess electrode material is removed by a process such as chemical-mechanical planarization/polishing (CMP), etching, and polishing
Implementation Method 3
the bonding includes a layered process selected from at least one of thick film, thin film, thermal spray, and sol-gel
Data Source
AI summary
A method of constructing an E-puck includes forming at least one trench into a lower substrate, depositing an electrode material onto the lower substrate and into the at least one trench, removing excess electrode material from the lower substrate to leave the electrode material within the at least one trench to form an electrode, and forming a dielectric on the lower substrate and the electrode. The electrode is between the lower substrate and the upper substrate. Forming the at least one trench into the lower substrate forms at least one standoff portion adjacent to the at least one trench and the at least one standoff portion reduces dishing of the electrode material during removal of the excess electrode material from the lower substrate.