Electrostatic Spray Drying for Flavor Encapsulation
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Solution Overview
Problem
Conventional spray drying systems for flavor encapsulation require high temperatures, leading to flavor profile changes and increased energy costs, while reducing temperatures results in slower carrier film formation and flavor loss.
Innovation Solution
An electrostatic spray drying process that applies an electrostatic field to atomized emulsion droplets, reducing the need for high heat and allowing for the production of a free-flowing encapsulated powder at lower temperatures, using a formulation of 50-95% wall material and 5-50% core material, with optional additives for improved encapsulation efficiency and hydration properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high temperatures (150-210°C inlet) are used in conventional spray drying systems, then carrier film formation and dehydration are improved, but flavor profile degradation and energy consumption increase
Solution Approach 1:
The patent changes the temperature parameter from conventional high temperatures (150-210°C inlet) to lower temperatures (50-150°C inlet, preferably 70-120°C), and introduces electrostatic field parameters (voltage 5-60 kV) to compensate for the reduced thermal energy, maintaining carrier film formation while preserving flavor profile
Solution Approach 2:
The patent replaces the thermal mechanism (heat-driven carrier film formation) with an electrostatic mechanism (electrostatically-assisted atomization and drying), where electrostatic fields enhance droplet evaporation and carrier film formation efficiency at lower temperatures, substituting thermal energy with electrical field energy
2Reliability
If high temperatures (150-210°C inlet) are used in conventional spray drying systems, then carrier film formation is improved, but energy consumption and pre-conditioning time increase
Solution Approach 1:
The patent changes the temperature parameter from conventional high temperatures (150-210°C inlet) to lower temperatures (50-150°C inlet, preferably 70-120°C), and introduces electrostatic field parameters (voltage 5-60 kV) to compensate for the reduced thermal energy, maintaining carrier film formation while preserving flavor profile
Solution Approach 2:
The patent replaces the thermal mechanism (heat-driven carrier film formation) with an electrostatic mechanism (electrostatically-assisted atomization and drying), where electrostatic fields enhance droplet evaporation and carrier film formation efficiency at lower temperatures, substituting thermal energy with electrical field energy
3Use of energy by moving object
If low temperatures (e.g., 120°C inlet) are used to reduce energy consumption, then energy costs decrease, but carrier film formation becomes slower and flavor retention deteriorates
Solution Approach 1:
The patent replaces the thermal mechanism (heat-driven carrier film formation) with an electrostatic mechanism (electrostatically-assisted atomization and drying), where electrostatic fields enhance droplet evaporation and carrier film formation efficiency at lower temperatures, substituting thermal energy with electrical field energy
Solution Approach 2:
The patent changes the temperature parameter from conventional high temperatures (150-210°C inlet) to lower temperatures (50-150°C inlet, preferably 70-120°C), and introduces electrostatic field parameters (voltage 5-60 kV) to compensate for the reduced thermal energy, maintaining carrier film formation while preserving flavor profile
4Use of energy by moving object
If low temperatures (e.g., 120°C inlet) are used to reduce energy consumption, then energy costs decrease, but flavor retention and surface oil content control deteriorate
Solution Approach 1:
The patent replaces the thermal mechanism (heat-driven carrier film formation) with an electrostatic mechanism (electrostatically-assisted atomization and drying), where electrostatic fields enhance droplet evaporation and carrier film formation efficiency at lower temperatures, substituting thermal energy with electrical field energy
Solution Approach 2:
The patent changes the temperature parameter from conventional high temperatures (150-210°C inlet) to lower temperatures (50-150°C inlet, preferably 70-120°C), and introduces electrostatic field parameters (voltage 5-60 kV) to compensate for the reduced thermal energy, maintaining carrier film formation while preserving flavor profile
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process results in a product with improved encapsulation efficiency, faster hydration, reduced surface oil content, and a flavor profile closer to the original, with lower energy consumption and processing time, while minimizing flavor loss and oxidation.
Implementation Method 1
applying an electrostatic field at the site of atomization
Implementation Method 2
the application of an electrostatic field to convert a liquid emulsion to a free-flowing powder
Data Source
AI summary
Disclosed is an electrostatic spray drying process for encapsulating a core material, such as a volatile flavor oil, within a carrier or wall material. The process is achieved by atomizing a liquid emulsion comprising the core material and the wall material, applying an electrostatic charge at the site of atomization, and drying the atomized emulsion into an encapsulated, free-flowing powder. Applying an electrostatic charge at the site of atomization allows the spray drying to be accomplished at significantly reduced temperatures, in particular, inlet temperatures in the range of 25° C. to 110° C., and outlet temperatures in the range of 25° C. to 80° C. The low drying temperatures impart improvements in the resulting encapsulated powdered product, including better retention of volatile flavor components, a flavor profile comparable to that of the starting liquid formulation, and better hydration and dissolution in water-based applications.


