Electrostatic Substrate Bonding for Fast, Precise 3D Alignment
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Solution Overview
Problem
Current tools for substrate stacking in 3D manufacturing are either high-accuracy or high-volume, but not both, posing a challenge in achieving both high speed and excellent alignment accuracy during bonding operations.
Innovation Solution
A device utilizing electrostatic clamping and alignment, where a voltage source applies a voltage between conductive surfaces of the substrates to align them based on electrostatic forces, allowing for precise alignment and bonding through stages movable in six degrees of freedom, with optional mechanical alignment and electrostatic clamping to enhance stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional substrate stacking tools are used, then high-volume production is achieved, but alignment accuracy deteriorates
Solution Approach 1:
The patent replaces conventional mechanical alignment systems with an electrostatic field-based alignment system. Voltage is applied between conductive surfaces on opposing substrates to generate electrostatic forces that automatically align the substrates. This substitution enables high-speed alignment without sacrificing precision, as the electrostatic forces act rapidly and uniformly across the substrate surfaces.
Solution Approach 2:
The patent changes the physical state and properties of the alignment process by applying voltage to create electrostatic fields. By controlling the voltage parameter, the system generates adjustable electrostatic forces that can quickly and accurately align substrates. This parameter change allows the system to achieve both high speed and high precision simultaneously, resolving the traditional trade-off between productivity and manufacturing precision.
2Manufacturing precision
If high-accuracy alignment tools are used, then alignment precision is improved, but production speed deteriorates
Solution Approach 1:
The patent replaces slow, mechanical alignment procedures with rapid electrostatic field-based alignment. By applying voltage between conductive surfaces, the system generates electrostatic forces that instantly act on the substrates to achieve precise alignment. This eliminates the time-consuming mechanical adjustment processes while maintaining or improving alignment accuracy.
Solution Approach 2:
The electrostatic alignment process enables continuous, uninterrupted alignment action across the entire substrate surface simultaneously. Unlike sequential mechanical alignment methods, the electrostatic field acts uniformly and continuously on all conductive surfaces, achieving precise alignment in a single rapid operation rather than through multiple slow adjustment steps.
3Manufacturing precision
If electrostatic voltage is applied between conductive surfaces, then alignment accuracy is improved, but energy consumption increases
Solution Approach 1:
The patent applies electrostatic voltage only to the specific conductive surfaces required for alignment, rather than to entire substrates or large areas. This partial application of electrostatic force concentrates energy where it is most needed for alignment, achieving high precision while minimizing overall energy consumption. The voltage is applied selectively to conductive pads or alignment features rather than uniformly across all surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-speed, high-accuracy alignment and bonding of substrates, ensuring precise registration of conductive pads and features, thereby improving the efficiency and reliability of 3D stacking processes.
Implementation Method 1
a voltage source, configured and arranged to produce a voltage between the conductive surfaces of the first electrical components and conductive surfaces of the second electrical components
Implementation Method 2
to align corresponding ones of the plurality of conductive surfaces of the first electrical component with corresponding ones of the plurality of conductive surfaces on the second electrical component at least partially on the basis of an electrostatic force therebetween
Data Source
AI summary
A device for aligning and placing electrical components includes a first stage to support at least one first electrical component, each first electrical component having a plurality of conductive surfaces on a side opposite the first stage, a second stage to support at least one second electrical component, each second electrical component having a plurality of conductive surfaces on a side opposite the second stage, a voltage source to produce a voltage between the conductive surfaces of the first electrical components and conductive surfaces of the second electrical components, and a controller to control relative motion between the first stage and the second stage, and to align corresponding ones of the plurality of conductive surfaces of the first electrical component with corresponding ones of the plurality of conductive surfaces on the second electrical component at least partially on the basis of an electrostatic force therebetween.