Electrostatic Substrate Carrier for Small Wafer Handling
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Solution Overview
Problem
Current semiconductor processing equipment is inadequate for handling smaller or thinner substrates and substrate pieces, as it is not designed to accommodate varying sizes and thicknesses, leading to difficulties in transfer and processing.
Innovation Solution
A substrate carrier equipped with electrostatic chucking electrodes that can selectively chuck substrates and masks to the carrier, allowing for secure handling and transfer of substrates of various sizes and thicknesses, including smaller and thinner ones, by using multiple electrode assemblies and a recessed pocket configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If processing equipment is designed for a single substrate size, then substrate transfer characteristics are improved and damage is prevented, but the equipment cannot accommodate smaller or thinner substrates or substrate pieces
Solution Approach 1:
The carrier is designed with a universal interface that can accommodate multiple substrate sizes and types through adjustable positioning mechanisms. The carrier body includes standardized features that work with various substrate dimensions, allowing the same carrier to handle both large wafers and small substrate pieces without requiring multiple specialized carriers.
Solution Approach 2:
The carrier incorporates movable and adjustable components such as positionable clamps, adjustable electrostatic chuck regions, and flexible positioning arms that can adapt their configuration based on the substrate size being processed. This dynamic adjustability allows the carrier to maintain optimal transfer characteristics across different substrate dimensions.
2Device complexity
If standard transfer equipment is used for thin substrates, then equipment simplicity is maintained, but substrate damage risk increases due to inadequate support
Solution Approach 1:
The carrier replaces traditional mechanical contact-based holding mechanisms with electrostatic chucking technology. The electrostatic field provides distributed support across the entire substrate surface without requiring physical contact points, eliminating stress concentrations that could damage thin substrates while maintaining equipment simplicity.
Solution Approach 2:
The carrier allows adjustment of electrostatic field strength and distribution parameters to match the specific thickness and material properties of different substrates. By changing these electrical parameters rather than mechanical structure, the system can safely handle substrates as thin as 100 μm without increasing mechanical complexity.
3Adaptability or versatility
If multiple electrode assemblies are added to handle different substrate sizes, then substrate size versatility is improved, but device complexity increases
Solution Approach 1:
The electrode system is divided into multiple independently controllable electrode assemblies, each capable of being activated or deactivated based on the substrate size being processed. This segmentation allows the system to provide electrostatic support only in the regions needed for the current substrate, reducing overall system complexity while maintaining versatility.
Solution Approach 2:
The electrode assemblies are designed with dynamic control capabilities, allowing the system to selectively activate specific electrode regions based on substrate placement. This dynamic activation pattern reduces the effective complexity by only engaging necessary electrodes for each specific substrate size, rather than requiring all electrodes to be simultaneously active.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables secure and efficient transfer and processing of small substrates and substrate pieces by providing a robust electrostatic chucking mechanism, compatible with various plasma and vacuum processes, and suitable for high-temperature applications.
Implementation Method 1
The substrate carrier is configured to electrostatically couple a substrate to the carrier
Implementation Method 2
The substrate carrier may be configured to electrostatically couple a mask to the carrier that is disposed over a region of the carrier not occupied by the substrate
Data Source
AI summary
Embodiments described herein relate to an apparatus and method for securing and transferring substrates. A substrate carrier, having one or more electrostatic chucking electrodes disposed therein, electrostatically couples a substrate to the carrier. Optionally, a mask may also be electrostatically coupled to the carrier and may be disposed over a region of the carrier not occupied by the substrate. In one embodiment, multiple electrode assemblies are provided such that a first electrode assembly chucks the substrate to the carrier and a second electrode assembly chucks the mask to the carrier. In another embodiment, a pocket is formed in the carrier and an electrode assembly provides chucking capability within the pocket.