Electrothermal Co-Simulation for Power Semiconductor Junction Temperature
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current power electronic system design separates electrical and thermal evaluations, leading to complex junction temperature calculations, inaccurate simulations due to inconsistent time constants, and slow simulation speeds, which hinder efficient R&D and product development.
Innovation Solution
An electrothermal co-simulation method that dynamically controls electrical simulations to suspend and maintain steady-state conditions, allowing for simultaneous electrical and junction temperature simulations, reducing calculation load and accelerating convergence while ensuring accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If electrical simulation uses small step size to ensure accuracy, then simulation accuracy is improved, but simulation speed deteriorates
Solution Approach 1:
The patent implements dynamic simulation step size adjustment, where the step size automatically adapts based on the simulation state. During steady-state periods, larger step sizes are used to accelerate simulation, while during transient states, smaller step sizes maintain accuracy. This dynamic adjustment resolves the contradiction between accuracy and speed.
Solution Approach 2:
The patent employs periodic sampling of electrical parameters at strategically selected time points rather than continuous small-step simulation. By periodically capturing key state variables and using them for thermal simulation, the method achieves accurate results without the computational burden of continuous fine-step electrical simulation.
2Stability of the object's composition
If electrical and thermal simulations are run simultaneously with consistent time constants, then simulation convergence is improved, but calculation complexity worsens
Solution Approach 1:
The patent decouples the time scales of electrical and thermal simulations by running them in a master-slave configuration. The electrical simulation runs at fast time scales to generate loss data, while the thermal simulation runs at slow time scales using this data. This dimensional separation allows each simulation to operate at its optimal time scale without convergence issues.
Solution Approach 2:
The patent segments the electrothermal simulation into distinct electrical and thermal modules that operate semi-independently. The electrical simulation generates power loss data which is then fed to the thermal simulation. This segmentation allows each module to be optimized separately and avoids the complexity of fully coupled simultaneous simulation.
3Adaptability or versatility
If junction temperature is calculated under all working conditions, then evaluation completeness is improved, but calculation time worsens
Solution Approach 1:
The patent creates a universal electrothermal co-simulation platform that can evaluate multiple working conditions through parameterization. By defining the electrical simulation with parametric inputs representing different operating scenarios, the system can automatically evaluate completeness across all conditions without manually running separate simulations for each case.
Solution Approach 2:
The patent performs preliminary electrical simulation to generate comprehensive loss data across the operating range before conducting thermal analysis. This preliminary action prepares all necessary electrical characteristics in advance, allowing the thermal simulation to efficiently evaluate junction temperature under all working conditions without repeated electrical calculations.
Data Source
AI summary
The disclosure relates to the field of power electronic technology, and discloses an electrothermal co-simulation method, system and terminal for the power electronic system, comprising the following steps: carrying out electrical simulation on the power semiconductor device and its power circuit, and junction temperature simulation on the power semiconductor device; acquiring real-time electrical parameters in the electrical simulation process; suspending the electrical simulation in a steady state until the steady state of the electrical simulation is changed; and calculating the junction temperature according to the real-time electrical parameters and in combination with the real-time loss of the power semiconductor device in the electrical simulation process. The disclosure dynamically controls the electrical simulation state, thereby reducing the calculation amount in the simulation process and achieving the purpose of accelerating the simulation convergence.