Electroviscosity Layer for Flexible Substrate Bonding
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Solution Overview
Problem
Current methods for attaching and peeling off flexible substrates from carrier substrates in flexible display technology are complex, often resulting in residue or difficulty in separation, and are costly due to the use of adhesives and material coating processes.
Innovation Solution
A substrate structure with a bonding layer comprising an electroviscosity layer that changes viscosity under an electric field, allowing for easy attachment and detachment of flexible substrates by applying and removing the electric field, along with a method for bonding and peeling using this electroviscosity layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive is used to attach flexible substrate to carrier substrate, then the flexible substrate can be fixed and formed, but it is difficult to peel off the finished flexible substrate and adhesive residue remains
Solution Approach 1:
The patent applies parameter changes by utilizing the electroviscous effect to dynamically change the viscosity parameter of the bonding layer. When electric field is applied, the viscosity increases to provide strong bonding; when electric field is removed, the viscosity decreases to enable easy peeling. This resolves the contradiction between strong attachment and easy detachment.
Solution Approach 2:
The bonding layer transitions from a static adhesive to a dynamic material whose bonding strength can be controlled in real-time through electric field application. The electroviscous fluid allows the system to switch between bonded and detached states, enabling both secure attachment during manufacturing and easy peeling after device formation.
2Ease of manufacture
If raw material for flexible substrate is applied onto carrier substrate and formed through setting, then the flexible substrate can be created, but it is expensive to coat raw material and difficult to peel off after forming devices
Solution Approach 1:
The patent changes the physical state parameter of the bonding material from solid adhesive to electroviscous fluid, which can be precisely controlled and removed without leaving residue. This reduces material waste and cost while enabling complete substrate recovery.
Solution Approach 2:
The electroviscous bonding layer can be completely removed after the flexible substrate is formed and devices are created, allowing the carrier substrate to be recovered and reused. This eliminates the cost of disposable adhesives and enables sustainable manufacturing processes.
3Strength
If adhesive is used to bond flexible substrate, then strong bonding is achieved, but the process becomes complex and carrier substrate cannot be recycled
Solution Approach 1:
The patent replaces the chemical bonding mechanism of traditional adhesives with a physical field-based mechanism (electroviscous effect). This substitution simplifies the bonding process by eliminating complex adhesive application and curing steps, while enabling precise control through electric field application.
Solution Approach 2:
The bonding process uses periodic application and removal of electric field to control the bonding state. Electric field is applied during manufacturing for strong bonding, then removed when peeling is needed, creating a simple on/off control mechanism that reduces process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates efficient bonding and peeling of flexible substrates with reduced material costs and simplified processes, enabling recycling of carrier substrates and bonding layers while minimizing residue and contamination.
Implementation Method 1
the bonding layer comprises an electroviscosity layer, viscous strength of which changes under effect of electric field
Data Source
AI summary
A substrate structure and methods for method for attaching a flexible substrate and for peeling off a flexible substrate are disclosed. The substrate structure includes a carrier substrate and a flexible substrate disposed on the carrier substrate, the substrate structure further including a bonding layer interposed between the carrier substrate and the flexible substrate, or more than one bonding layers parallel interposed between the carrier substrate and the flexible substrate, wherein the bonding layer includes an electroviscosity layer, viscous strength of which changes under effect of electric field, the electroviscosity layer is disposed on a contact surface between the bonding layer and the flexible substrate.