Electrowetting Heat Spreading for Mobile Device Hotspots

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Portable electronic devices often experience local hotspots due to heat generation, leading to uncomfortable user experiences and the need for improved thermal management.

Innovation Solution

Incorporating an electrowetting device that is electrically coupled to integrated devices within the electronic device, allowing the electrowetting device to redistribute heat across the device's surface by moving a liquid along a surface element.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If conventional passive thermal management is used, then device structure is simple, but hotspots cannot be effectively reduced

Engineering Contradiction:
Improvehotspot reductionVSAvoiddevice complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent implements dynamic thermal management by making the liquid flow path configurable through electrowetting actuators. The system can dynamically adjust liquid flow directions and paths based on real-time temperature distributions, enabling adaptive hotspot reduction rather than static passive cooling. This dynamic control allows the same physical infrastructure to address varying thermal conditions efficiently.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent introduces an electrowetting device as an intermediary between the heat-generating integrated devices and the liquid cooling system. This intermediary uses electrical fields to control liquid movement, providing precise thermal management without direct mechanical contact with the integrated devices. The electrowetting actuator serves as a non-intrusive mediator that enables sophisticated thermal control while maintaining device simplicity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Adaptability or versatility

If liquid flow paths are fixed, then device complexity is low, but thermal management adaptability is poor

Engineering Contradiction:
Improvethermal management adaptabilityVSAvoiddevice complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent transforms fixed liquid flow paths into dynamic, reconfigurable paths using electrowetting actuators. Multiple liquid flow channels are provided with controllable valves or actuators that can direct liquid flow to different regions based on thermal conditions. This enables the system to adapt to varying thermal loads and hotspot locations without requiring multiple complete cooling systems.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent designs a multi-functional liquid cooling system where a single liquid cooling device can serve multiple thermal management functions. By providing reconfigurable liquid flow paths, the same cooling infrastructure can address different thermal scenarios, cool multiple integrated devices, and provide both localized hotspot reduction and overall thermal management, eliminating the need for separate cooling systems for each function.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The electrowetting device effectively reduces and eliminates hotspots, providing improved thermal management without throttling the integrated devices, thus enhancing the device's operational performance and user comfort.

Implementation Method 1

an electrowetting device configured to be electrically coupled to the second integrated device. The electrowetting device is configured to redistribute heat across a surface of the device by moving a liquid in the electrowetting device, along a surface element of the device

Methodology Applied
Scientific EffectElectrowetting: Electrowetting

Implementation Method 2

The electrowetting device is configured to redistribute heat across a surface of the device by moving a liquid in the electrowetting device

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS12306396B2Electronic device comprising an electrowetting device
Publication Date: 2025.05.20 QUALCOMM INC
  • US12306396B2 patent drawing
  • US12306396B2 patent drawing
  • US12306396B2 patent drawing

AI summary

A device that includes a first integrated device, a second integrated device configured to be electrically coupled to the first integrated device and an electrowetting device configured to be electrically coupled to the second integrated device. The electrowetting device is configured to redistribute heat across a back surface of the device by looping a liquid in the electrowetting device, along the back surface of the device.