Electrowetting Vapor Chamber Heat Spreader for Dry-Out Control
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Solution Overview
Problem
Conventional vapor chambers used as heat spreaders in microelectronics have a dry out limit that is one-to-two orders of magnitude less than the power levels observed in current microelectronic devices, limiting their effectiveness in high heat flux applications.
Innovation Solution
A vapor chamber heat spreader integrated with microelectronic devices that utilizes electrowetting through electrodes powered by electrically conductive via structures to reroute liquid to hot spots, increasing the dry out limit significantly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional vapor chambers are used for heat spreading, then heat removal is achieved, but the dry out limit is one-to-two orders of magnitude less than the power levels in current microelectronic devices
Solution Approach 1:
The patent applies electrowetting to dynamically control the wetting properties of the liquid coolant on the heating surface. By applying voltage to the electrode, the contact angle of the liquid is reduced, enhancing liquid spreading and preventing dry out. This dynamic adjustment allows the vapor chamber to adapt to varying power levels and maintain reliable heat removal beyond conventional dry out limits
Solution Approach 2:
The invention changes the wetting parameter (contact angle) of the liquid coolant by applying electrical voltage through the electrode. This parameter change transforms the hydrophobic surface into a more hydrophilic state, improving liquid distribution and extending the dry out limit to match higher power levels in modern microelectronic devices
Data Source
AI summary
A vapor chamber heat spreader is provided that is integrated with a microelectronic device. The vapor chamber heat spreader of the present application facilitates heat spreading and heat removal from the microelectronic device, while having an increased dry out limit that is significantly greater than conventional vapor chambers. The increased dry out limit of the vapor chamber heat spreader of the present application is achieved by electrowetting using electrodes that are powered by the microelectronic device. The electrodes reroute the liquid to hot spots to avoid dry out.