Element Chip Manufacturing via Laser Scribing and Plasma Dicing
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Solution Overview
Problem
The existing method for manufacturing element chips results in damaged regions due to thermal influence during laser scribing, leading to reduced flexural strength and potential cleavage of the chips, as the damaged regions act as starting points for cleavage and can cause the chips to be damaged.
Innovation Solution
A method involving laser scribing, anisotropic etching, protection film stacking, protection film etching, and plasma dicing, where the damaged regions are covered and protected, preventing exposure and subsequent cleavage, thereby enhancing the flexural strength of the element chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser scribing is performed to divide the substrate, then the substrate can be divided into element regions, but damaged regions are formed due to thermal influence which reduces flexural strength
Solution Approach 1:
The patent applies preliminary action by performing laser scribing to create dividing grooves before the actual dicing process. The laser light L irradiates the dividing region R11 to form a groove, which serves as a pre-prepared separation path that guides subsequent processing steps and reduces the force needed for final separation, thereby maintaining chip strength while enabling efficient division.
Solution Approach 2:
The patent introduces an intermediary substance (adhesive or resin) that is filled into the laser-formed dividing groove. This intermediary material acts as a mediator that bonds adjacent element regions together during handling while allowing clean separation during dicing. The intermediary prevents direct mechanical stress on the chip edges, thereby preserving flexural strength while enabling substrate division.
2Manufacturing precision
If plasma etching is used to remove the dividing region after laser scribing, then the division is completed, but the damaged region remains on the element chip end surface causing cleavage
Solution Approach 1:
The patent applies the taking out principle by selectively removing only the dividing region material that was damaged by laser irradiation, while carefully preserving the adjacent element regions. The plasma etching process targets specifically the compromised material in the dividing groove, extracting the harmful damaged portions without affecting the integrity of the element chips themselves.
Solution Approach 2:
The patent applies local quality by applying different treatment intensities to different regions: aggressive plasma etching is applied locally to the dividing region where damage occurred, while the element regions receive protective treatment or no treatment. This localized approach ensures that precision division is achieved where needed while maintaining chip integrity where it matters most.
3Productivity
If the dividing region is removed completely, then the substrate is diced into separate chips, but the damaged region acts as a starting point for cleavage reducing flexural strength
Solution Approach 1:
The patent converts the harmful laser-damaged region into a beneficial feature by using the damaged groove as a predetermined separation path. The damage creates a zone of reduced material strength that actually facilitates clean separation during dicing, while the groove geometry and subsequent filling with intermediary material ensure that the final chip edges remain intact and strong, transforming the potential defect into a manufacturing advantage.
Solution Approach 2:
The patent uses a flexible intermediary material (adhesive or resin) that can accommodate the damaged region while providing structural support. This flexible film fills the damaged groove and bonds adjacent chips during handling, preventing cleavage propagation, while allowing the underlying damaged structure to serve its separation function during dicing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively improves the flexural strength of element chips by preventing cleavage and reducing damage from external forces, ensuring the chips are not compromised by thermal influences during the manufacturing process.
Implementation Method 1
In the laser scribing step, damaged region DR is formed on substrate 30 due to thermal influence. Damaged region DR is formed to be wider than dividing region R11 irradiated with laser light by heat propagation.
Implementation Method 2
substrate 30 is diced through etching with plasma P after scribing dividing region R11 with laser light L
Implementation Method 3
the substrate is divided to a plurality of element chips including the element region through etching the dividing region anisotropically by exposing the substrate to third plasma in a state where the second main surface is supported by a supporting member
Data Source
AI summary
A method for manufacturing an element chip includes a protection film stacking step of staking a protection film to the element region, and the dividing region, the part of the exposed second damaged region and a protection film etching step of removing a part of the protection film which is stacked on the dividing region and the protection film which is stacked on the element region by exposing the substrate to second plasma and remaining the protection film for covering the part of the second damaged region. Furthermore, the method for manufacturing an element chip includes a plasma dicing step of dividing the substrate to a plurality of element chips by exposing the substrate to third plasma in a state where the second main surface is supported by a supporting member.